Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Moore; Scott E.
Address:
Meridian, ID
No. of patents:
138
Patents:


1 2 3










Patent Number Title Of Patent Date Issued
8269605 RFID material tracking method and apparatus September 18, 2012
A method and apparatus for tracking items automatically is described. A passive RFID (Radio Frequency IDentification) tag is used with a material tracking system capable of real-time pinpoint location and identification of thousands of items in production and storage areas. Passive RFID
8209874 Building frame construction tools and methods using laser alignment July 3, 2012
A frame construction tool system, for wood frame buildings, or for metal, polymer, concrete, or composite frame buildings, and methods of using some or all of the tools of said tool system, are particularly well-adapted for roof and/or wall construction. Preferably, a laser light uni
8125316 RFID material tracking method and apparatus February 28, 2012
A method and apparatus for tracking items automatically is described. A passive RFID (Radio Frequency IDentification) tag is used with a material tracking system capable of real-time pinpoint location and identification of thousands of items in production and storage areas. Passive RFID
7808367 RFID material tracking method and apparatus October 5, 2010
A method and apparatus for tracking items automatically is described. A passive RFID (Radio Frequency IDentification) tag is used with a material tracking system capable of real-time pinpoint location and identification of thousands of items in production and storage areas. Passive RFID
7625495 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planari December 1, 2009
Methods and devices for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method of planarizing a microelectronic substrate assembly in accordance with the invention includes pressi
7618528 Methods and apparatus for electromechanically and/or electrochemically-mechanically removing con November 17, 2009
Methods and apparatuses for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate. An apparatus in accordance with one embodiment includes a support member configured to releasably carry a microelectronic substrate and
7604729 Methods and apparatus for selectively removing conductive material from a microelectronic substr October 20, 2009
Methods and apparatuses for selectively removing conductive materials from a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from an electrode pair that includes a f
7560017 Methods and apparatus for electrically detecting characteristics of a microelectronic substrate July 14, 2009
Methods and apparatuses for detecting characteristics of a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from the first and second spaced apart electrodes, contact
7538880 Turbidity monitoring methods, apparatuses, and sensors May 26, 2009
Semiconductor processors, sensors, semiconductor processing systems, semiconductor workpiece processing methods, and turbidity monitoring methods are provided. According to one aspect, a semiconductor processor includes a process chamber configured to receive a semiconductor workpiec
7530877 Semiconductor processor systems, a system configured to provide a semiconductor workpiece proces May 12, 2009
Semiconductor processor systems, systems configured to provide a semiconductor workpiece process fluid, semiconductor workpiece processing methods, methods of preparing semiconductor workpiece process fluid, and methods of delivering semiconductor workpiece process fluid to a semicon
7524410 Methods and apparatus for removing conductive material from a microelectronic substrate April 28, 2009
A method and apparatus for removing conductive material from a microelectronic substrate is disclosed. One method includes disposing an electrolytic liquid between a conductive material of a substrate and at least one electrode, with the electrolytic liquid having about 80% water or
7438632 Method and apparatus for cleaning a web-based chemical mechanical planarization system October 21, 2008
A method and apparatus for cleaning a web-based chemical-mechanical planarization (CMP) system. Specifically, a fluid spray bar is coupled to a frame assembly which may be mounted on a CMP system. The fluid spray bar will move along the frame assembly. As the fluid spray bar traverses
7294040 Method and apparatus for supporting a microelectronic substrate relative to a planarization pad November 13, 2007
A method and apparatus for planarizing a microelectronic substrate. In one embodiment, one surface of the microelectronic substrate is engaged with a planarizing pad and the opposite surface of the microelectronic substrate is positioned proximate to a substrate support. A bearing li
7278905 Apparatus and method for conditioning polishing surface, and polishing apparatus and method of o October 9, 2007
A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then the conditioned pad portion may be used again for polishing. The conditioning device is
7273411 Polishing apparatus September 25, 2007
A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then the conditioned pad portion may be used again for polishing. The conditioning device is
7261832 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planari August 28, 2007
Methods and devices for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method of planarizing a microelectronic substrate assembly in accordance with the invention includes pressi
7229336 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planariz June 12, 2007
A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium an
7220166 Methods and apparatus for electromechanically and/or electrochemically-mechanically removing con May 22, 2007
Methods and apparatuses for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate. An apparatus in accordance with one embodiment includes a support member configured to releasably carry a microelectronic substrate and
7180591 Semiconductor processors, sensors, semiconductor processing systems, semiconductor workpiece pro February 20, 2007
Semiconductor processors, sensors, semiconductor processing systems, semiconductor workpiece processing methods, and turbidity monitoring methods are provided. According to one aspect, a semiconductor processor includes a process chamber configured to receive a semiconductor workpiec
7172491 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planariz February 6, 2007
A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium an
7160176 Methods and apparatus for electrically and/or chemically-mechanically removing conductive materi January 9, 2007
A method and apparatus for removing conductive material from a microelectronic substrate. In one embodiment, a support member supports a microelectronic substrate relative to a material removal medium, which can include first and second electrodes and a polishing pad. One or more ele
7153410 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces December 26, 2006
Methods and apparatuses for electrochemical-mechanical processing of microelectronic workpieces. One embodiment of an electrochemical processing apparatus in accordance with the invention comprises a workpiece holder configured to receive a microelectronic workpiece, a workpiece elec
7153195 Methods and apparatus for selectively removing conductive material from a microelectronic substr December 26, 2006
Methods and apparatuses for selectively removing conductive materials from a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from an electrode pair that includes a f
7144304 Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surfa December 5, 2006
A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic subs
7134934 Methods and apparatus for electrically detecting characteristics of a microelectronic substrate November 14, 2006
Methods and apparatuses for detecting characteristics of a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from the first and second spaced apart electrodes, contact
7118455 Semiconductor workpiece processing methods October 10, 2006
Semiconductor processors, sensors, semiconductor processing systems, semiconductor workpiece processing methods, and turbidity monitoring methods are provided. According to one aspect, a semiconductor processor includes a process chamber configured to receive a semiconductor workpiec
7118447 Semiconductor workpiece processing methods October 10, 2006
Semiconductor processor systems, systems configured to provide a semiconductor workpiece process fluid, semiconductor workpiece processing methods, methods of preparing semiconductor workpiece process fluid, and methods of delivering semiconductor workpiece process fluid to a semicon
7118445 Semiconductor workpiece processing methods, a method of preparing semiconductor workpiece proces October 10, 2006
Semiconductor processor systems, systems configured to provide a semiconductor workpiece process fluid, semiconductor workpiece processing methods, methods of preparing semiconductor workpiece process fluid, and methods of delivering semiconductor workpiece process fluid to a semicon
7112122 Methods and apparatus for removing conductive material from a microelectronic substrate September 26, 2006
A method and apparatus for removing conductive material from a microelectronic substrate is disclosed. One method includes disposing an electrolytic liquid between a conductive material of a substrate and at least one electrode, with the electrolytic liquid having about 80% water or
7112121 Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material September 26, 2006
A method and apparatus for removing conductive material from a microelectronic substrate. In one embodiment, the method can include engaging a microelectronic substrate with a polishing surface of a polishing pad, electrically coupling a conductive material of the microelectronic sub
7094131 Microelectronic substrate having conductive material with blunt cornered apertures, and associat August 22, 2006
A microelectronic substrate and method for removing conductive material from a microelectronic substrate. In one embodiment, the microelectronic substrate includes a conductive or semiconductive material with a recess having an initially sharp corner at the surface of the conductive
7074113 Methods and apparatus for removing conductive material from a microelectronic substrate July 11, 2006
A method and apparatus for removing conductive material from a microelectronic substrate. In one embodiment, a support member supports a microelectronic substrate relative to first and second electrodes, which are spaced apart from each other and spaced apart from the microelectronic
7070659 System for filling openings in semiconductor products July 4, 2006
Explosive forces are used to fill interconnect material into trenches, via holes and other openings in semiconductor products. The interconnect material may be formed of metal. The metal may be heated prior to the force filling step. The explosive forces may be generated, for example,
7063603 Method and apparatus for cleaning a web-based chemical mechanical planarization system June 20, 2006
A method and apparatus for cleaning a web-based chemical-mechanical planarization (CMP) system. Specifically, a fluid spray bar is coupled to a frame assembly which may be mounted on a CMP system. The fluid spray bar will move along the frame assembly. As the fluid spray bar traverses
7063595 Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surfa June 20, 2006
A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic subs
7060608 System and method for filling openings in semiconductor products June 13, 2006
Explosive forces are used to fill interconnect material into trenches, via holes and other openings in semiconductor products. The interconnect material may be formed of metal. The metal may be heated prior to the force filling step. The explosive forces may be generated, for example,
7053775 RFID material tracking method and apparatus May 30, 2006
A method and apparatus for tracking items automatically is described. A passive RFID (Radio Frequency IDentification) tag is used with a material tracking system capable of real-time pinpoint location and identification of thousands of items in production and storage areas. Passive RFID
7042358 RFID material tracking method and apparatus May 9, 2006
A method and apparatus for tracking items automatically is described. A passive RFID (Radio Frequency IDentification) tag is used with a material tracking system capable of real-time pinpoint location and identification of thousands of items in production and storage areas. Passive RFID
7001845 Methods of treating surfaces of substrates February 21, 2006
In one aspect, the invention includes a method of treating a surface of a substrate. A mixture which comprises at least a frozen first material and liquid second material is provided on the surface and moved relative to the substrate. In another aspect, the invention encompasses a method
7001251 Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planariza February 21, 2006
A method and apparatus for releasably attaching a planarizing medium, such as a polishing pad, to the platen of a chemical-mechanical planarization machine. In one embodiment, the apparatus can include several apertures in the upper surface of the platen that are coupled to a vacuum sour
6997789 Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surfa February 14, 2006
A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic subs
6969297 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planariz November 29, 2005
A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is
6956538 RFID material tracking method and apparatus October 18, 2005
A method and apparatus for tracking items automatically is described. A passive RFID (Radio Frequency IDentification) tag is used with a material tracking system capable of real-time pinpoint location and identification of thousands of items in production and storage areas. Passive RFID
6949011 Method and apparatus for cleaning a web-based chemical mechanical planarization system September 27, 2005
A method and apparatus for cleaning a web-based chemical-mechanical planarization (CMP) system. Specifically, a fluid spray bar is coupled to a frame assembly which may be mounted on a CMP system. The fluid spray bar will move along the frame assembly. As the fluid spray bar traverses th
6945855 Method and apparatus for cleaning a web-based chemical mechanical planarization system September 20, 2005
A method and apparatus for cleaning a web-based chemical-mechanical planarization (CMP) system. Specifically, a fluid spray bar is coupled to a frame assembly which may be mounted on a CMP system. The fluid spray bar will move along the frame assembly. As the fluid spray bar traverses th
6922253 Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization July 26, 2005
A system for controlling a mechanical or chemical-mechanical planarizing machine comprises a light system, a sensor, and a computer. The light system can have at least a first emitter that generates a first light pulse having a first color and a second emitter that generates a second
6921318 Semiconductor die de-processing using a die holder and chemical mechanical polishing July 26, 2005
A method and apparatus for removing layers from a circuit side of a semiconductor die includes the use of a holder, for example a semiconductor wafer having an opening therein for receiving the semiconductor die. Additionally the holder can include one or more layers thereover which
6913519 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic sub July 5, 2005
A method and apparatus for mechanically and/or chemical-mechanically planarizing microelectronic substrates. In one embodiment in accordance with the principles of the present invention, a microelectronic substrate is planarized or polished on a planarizing medium having a thin film and
6858538 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planari February 22, 2005
Methods and devices for mechanical and/or chemical-mechanical polarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method of plagiarizing a micro electronic substrate assembly in accordance with the invention includes pressing
6840840 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planariz January 11, 2005
A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is
1 2 3










 
 
  Recently Added Patents
Method and system for weighted fair queuing
Illuminating device
SONOS stack with split nitride memory layer
Resin composition and display device using the same
Control system for shifting an automatic transmission
Wall flow type exhaust gas purification filter
Session transfer method, application server, and communications system
  Randomly Featured Patents
Apparatus for controlling gear box
Packaging container
Apparatus for raising concrete members
Assessing fetal lung maturity
Soil working hand tool
Convertible load carrying apparatus for all terrain vehicles
Resettable high-voltage capable high impedance biasing network for capacitive sensors
Golf club with four compartments for transporting liquids therein
Occupant protection device comprising safety valve
Techniques for decoding information from signals received over multiple channels