| Patent Number |
Title Of Patent |
Date Issued |
| 8007594 |
Method for manufacturing semiconductor device |
August 30, 2011 |
| A method for manufacturing a semiconductor device includes the step of conducting a cleaning process for a wafer formed with copper wiring lines to remove contaminations produced on a back surface of the wafer. The cleaning process is conducted by injecting onto the back surface of the |
| 7855109 |
Method for manufacturing a semiconductor device capable of preventing the generation of a bridge |
December 21, 2010 |
| A method for manufacturing a semiconductor device according to the present invention, comprising the steps of: forming a screen oxide layer over the surface of an active region of a semiconductor substrate in which an isolation structure defining the active region is formed; forming a fi |
| 7655535 |
Method for fabricating semiconductor device having trench isolation layer |
February 2, 2010 |
| A method for fabricating a device isolation structure of a semiconductor device includes the steps of forming a pad oxide layer and a pad nitride layer over a semiconductor substrate including a cell region and a dummy region, etching a portion of the pad nitride layer, the pad oxide lay |
| 7410909 |
Method of removing ion implanted photoresist |
August 12, 2008 |
| A method of removing an ion implanted photoresist comprises performing first cleaning a semiconductor substrate having the ion implanted photoresist using hot deionized water to which a megasonic process is applied, first rinsing the semiconductor substrate using cold deionized water |
