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Moon; Ok Min
Gyeonggi-do, KR
No. of patents:

Patent Number Title Of Patent Date Issued
8007594 Method for manufacturing semiconductor device August 30, 2011
A method for manufacturing a semiconductor device includes the step of conducting a cleaning process for a wafer formed with copper wiring lines to remove contaminations produced on a back surface of the wafer. The cleaning process is conducted by injecting onto the back surface of the
7855109 Method for manufacturing a semiconductor device capable of preventing the generation of a bridge December 21, 2010
A method for manufacturing a semiconductor device according to the present invention, comprising the steps of: forming a screen oxide layer over the surface of an active region of a semiconductor substrate in which an isolation structure defining the active region is formed; forming a fi
7655535 Method for fabricating semiconductor device having trench isolation layer February 2, 2010
A method for fabricating a device isolation structure of a semiconductor device includes the steps of forming a pad oxide layer and a pad nitride layer over a semiconductor substrate including a cell region and a dummy region, etching a portion of the pad nitride layer, the pad oxide lay
7410909 Method of removing ion implanted photoresist August 12, 2008
A method of removing an ion implanted photoresist comprises performing first cleaning a semiconductor substrate having the ion implanted photoresist using hot deionized water to which a megasonic process is applied, first rinsing the semiconductor substrate using cold deionized water

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