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Mok; Yeuk-Fai Edwin
San Francisco, CA
No. of patents:

Patent Number Title Of Patent Date Issued
7311810 Two position anneal chamber December 25, 2007
Embodiments of the invention generally provide an annealing apparatus and method for a semiconductor processing platform. The annealing apparatus includes a plurality of isolated annealing chambers, wherein each of the annealing chambers has a heating plate positioned in a sealed process
7223323 Multi-chemistry plating system May 29, 2007
Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one su
7138014 Electroless deposition apparatus November 21, 2006
An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palla
6869516 Method for removing electrolyte from electrical contacts and wafer touching areas March 22, 2005
A method for cleaning the electrical contact areas or substrate contact areas of an electrochemical plating contact ring is provided. Embodiments of the method include positioning a substrate on a substrate support member having one or more electrical contacts, chemically plating a metal
6824612 Electroless plating system November 30, 2004
A method and apparatus for plating substrates, wherein the apparatus includes a central substrate transfer enclosure having at least one substrate transfer robot positioned therein. A substrate activation chamber in communication with the central substrate transfer enclosure is provi
6689418 Apparatus for wafer rinse and clean and edge etching February 10, 2004
An apparatus for and method of rinsing one side of a two-sided substrate and removing unwanted material from the substrate's edge and/or backside. One embodiment of the method is directed toward rinsing and cleaning a substrate having a front side upon which integrated circuits are to be
6537011 Method and apparatus for transferring and supporting a substrate March 25, 2003
A method and apparatus for supporting and transferring a substrate in a semiconductor wafer processing system. In one aspect, a support ring having one or more substrate support members mounted thereon and defining a central opening therein for receipt of a substrate support member durin
6516815 Edge bead removal/spin rinse dry (EBR/SRD) module February 11, 2003
The present invention provides an apparatus for etching a substrate, comprising: a container; a substrate support disposed in the container; a rotation actuator attached to the substrate support; and a fluid delivery assembly disposed in the container to deliver an etchant to a periphera
6466426 Method and apparatus for thermal control of a semiconductor substrate October 15, 2002
A semiconductor wafer processing apparatus, and more specifically, a semiconductor substrate support pedestal having a substrate support, an isolator, and first and second heat transfer plates for providing a controllable, uniform temperature distribution across the diameter of a sem

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