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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Mok; Sammy
Address:
Cupertino, CA
No. of patents:
22
Patents:












Patent Number Title Of Patent Date Issued
7952373 Construction structures and manufacturing processes for integrated circuit wafer probe card asse May 31, 2011
Several embodiments of integrated circuit probe card assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor
7884634 High density interconnect system having rapid fabrication cycle February 8, 2011
An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The
7876087 Probe card repair using coupons with spring contacts and separate atachment points January 25, 2011
Probecard architectures partition the spring compliance required for IC testing between several different components. Such architectures can provide shorter springs, better impedance control, improved power/ground distribution and more direct paths to tester electronics. The probecards
7872482 High density interconnect system having rapid fabrication cycle January 18, 2011
An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The
7812626 High density interconnect system for IC packages and interconnect assemblies October 12, 2010
An improved interconnection system is described, such as for electrical contactors and connectors, electronic device or module package assemblies, socket assemblies, and/or probe card assembly systems. An exemplary connector comprises a first connector structure comprising a contacto
7772860 Massively parallel interface for electronic circuit August 10, 2010
Several embodiments of massively parallel interface structures are disclosed, which may be used in a wide variety of permanent or temporary applications, such as for interconnecting integrated circuits (ICs) to test and burn-in equipment, for interconnecting modules within electronic
7621761 Systems for testing and packaging integrated circuits November 24, 2009
Several embodiments of stress metal springs are disclosed, which typically comprise a plurality of stress metal layers that are established on a substrate, which are then controllably patterned and partially released from the substrate. An effective rotation angle is typically created in
7579848 High density interconnect system for IC packages and interconnect assemblies August 25, 2009
An improved interconnection system is described, such as for electrical contactors and connectors, electronic device or module package assemblies, socket assemblies, and/or probe card assembly systems. An exemplary connector comprises a first connector structure comprising a contacto
7403029 Massively parallel interface for electronic circuit July 22, 2008
Several embodiments of massively parallel interface structures are disclosed, which may be used in a wide variety of permanent or temporary applications, such as for interconnecting integrated circuits (ICs) to test and burn-in equipment, for interconnecting modules within electronic
7382142 High density interconnect system having rapid fabrication cycle June 3, 2008
An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The
7247035 Enhanced stress metal spring contactor July 24, 2007
Several embodiments of stress metal springs are disclosed, which typically comprise a plurality of stress metal layers that are established on a substrate, which are then controllably patterned and partially released from the substrate. An effective rotation angle is typically created in
7138818 Massively parallel interface for electronic circuit November 21, 2006
Several embodiments of massively parallel interface structures are disclosed, which may be used in a wide variety of permanent or temporary applications, such as for interconnecting integrated circuits (ICs) to test and burn-in equipment, for interconnecting modules within electronic
7137830 Miniaturized contact spring November 21, 2006
This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated
7126358 Construction structures and manufacturing processes for integrated circuit wafer probe card asse October 24, 2006
Several embodiments of integrated circuit probe card assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor
7126220 Miniaturized contact spring October 24, 2006
This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated
7009412 Massively parallel interface for electronic circuit March 7, 2006
Several embodiments of massively parallel interface structures are disclosed, which may be used in a wide variety of permanent or temporary applications, such as for interconnecting integrated circuits (ICs) to test and burn-in equipment, for interconnecting modules within electronic
6917525 Construction structures and manufacturing processes for probe card assemblies and packages havin July 12, 2005
Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on
6815961 Construction structures and manufacturing processes for integrated circuit wafer probe card asse November 9, 2004
Several embodiments of integrated circuit probe card assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor
6812718 Massively parallel interface for electronic circuits November 2, 2004
Several embodiments of massively parallel interface structures are disclosed, which may be used in a wide variety of permanent or temporary applications, such as for interconnecting integrated circuits (ICs) to test and burn-in equipment, for interconnecting modules within electronic
6799976 Construction structures and manufacturing processes for integrated circuit wafer probe card asse October 5, 2004
Several embodiments of integrated circuit probe card assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor
6791171 Systems for testing and packaging integrated circuits September 14, 2004
Several embodiments of stress metal springs are disclosed, which typically comprise a plurality of stress metal layers that are established on a substrate, which are then controllably patterned and partially released from the substrate. An effective rotation angle is typically created in
6710609 Mosaic decal probe March 23, 2004
The invention provides a mosaic decal probe, in which a mosaic of probe chips is assembled into a thin membrane that is suspended in a ring which is made of a material that has a TCE matching that of silicon. The membrane is mounted on the ring in tension, such as it stays in tension










 
 
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