| Patent Number |
Title Of Patent |
Date Issued |
| 7612295 |
Printed wiring board and method for manufacturing the same |
November 3, 2009 |
| In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon another. The first conductive layer (11) is constituted as a parts connecting layer and the n-th conductive layer (13) is constituted as an external |
| 7594320 |
Method of manufacturing printed wiring board |
September 29, 2009 |
| A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the |
| 7552531 |
Method of manufacturing a printed wiring board having a previously formed opening hole in an inn |
June 30, 2009 |
| A method of producing a printed wiring board comprising innerlayer conductor circuits among insulating layers and blind via-holes formed by irradiating laser beams from the outermost surface of the insulating layer toward the innerlayer conductor circuit. A central portion of the inn |
| 7339118 |
Printed wiring board and method for manufacturing the same |
March 4, 2008 |
| In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon each other. The first conductive layer (11) is a parts connecting layer and the n-th conductive layer (13) is an external connecting layer which is conne |
| 6986917 |
Printed wiring board and method of manufacturing the same |
January 17, 2006 |
| A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the |
| 6590165 |
Printed wiring board having throughole and annular lands |
July 8, 2003 |
| In the production of a printed wiring board comprising innerlayer conductor circuits 161, 131 arranged among insulating layers 101.about.103 and blind via-holes 141, 142 formed from an outermost surface of the insulating layer toward the innerlayer conductor circuit, an opening hole 160 |
| 6555208 |
Printed wiring board and method of manufacturing the same |
April 29, 2003 |
| A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the port |
| 6455783 |
Multilayer printed wiring board and method for manufacturing the same |
September 24, 2002 |
| A method for manufacturing a multilayer printed circuit board that shortens the distance between pattern layers and facilitates formation of a minute conductive hole having superior conductive reliability. A core substrate (21) including ad core pattern (12, 13), which has a pad (101, 11 |
| 6284353 |
Printed wiring board and method of manufacturing the same |
September 4, 2001 |
| A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the port |
