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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Mine; Katsutoshi
Address:
Chiba Prefecture, JP
No. of patents:
42
Patents:












Patent Number Title Of Patent Date Issued
7700678 Silver-based powder, method of preparation thereof, and curable silicone composition April 20, 2010
A silver-based powder is surface-treated with an oxidation inhibitor by means of a mechanochemical reaction. A method of preparation of the silver-based powder includes using an organic solution of the oxidation inhibitor as a lubricating agent, applying mechanical energy to the silv
7651958 Semiconductor device and method of manufacturing thereof January 26, 2010
A method of manufacturing a semiconductor device sealed in a cured silicone body by placing a semiconductor device into a mold and subjecting a curable silicone composition that fills the spaces between said mold and said semiconductor device to compression molding, wherein the curab
7534659 Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment compo May 19, 2009
A silicone-based adhesive sheet has either a layer of clay-like curable silicone composition on one side and a layer of slower curing clay-like curable silicone composition than the first composition layer on the other side, or a cured silicone layer on one side and a layer of clay-l
7375158 Thermoconductive curable liquid polymer composition and semiconductor device produced with the u May 20, 2008
A thermoconductive curable liquid polymer composition including (A) a curable liquid polymer, (B) a filler made from a thermally-elongatable shape-memory alloy, and (C) a thermoconductive filler other than (B). A semiconductor device having a semiconductor element glued or coated with
7074849 Silver-filled electrically conductive organosiloxane compositions July 11, 2006
The electrical properties, particularly contact resistance and volume resistivity, of materials prepared by curing organosiloxane compositions containing finely divided silver as the electroconductive filler are improved by treating the silver particles with an organosilicon compound
7056129 Anisotropically electroconductive adhesive film, method for the production thereof, and semicond June 6, 2006
An anisotropically electroconductive adhesive film is characterized by containing an electroconductive elastomer that traverses the thickness of the adhesive film and is insulated in the plane of the adhesive film comprising electrically insulating elastomer, and both the electrocond
6797772 Alkenyl polyorganosiloxane, organohydrogensiloxane, organosilicon or silane treated silver parti September 28, 2004
A composition comprises the product obtained by homogeneously blending: (A) 100 parts by weight of a polyorganosiloxane containing at least two alkenyl radicals per molecule, (B) an organohydrogensiloxane containing at least two silicon-bonded hydrogen atoms per molecule in a quantity
6764718 Method for forming thin film from electrically insulating resin composition July 20, 2004
A method for forming an electrically insulating thin film coating the surface of an electronic device with an electrically insulating thin-film-forming resin composition and crosslinking the composition by a method selected from the group consisting of heating and irradiation with hi
6761947 Silicone-based adhesive sheet, method for manufacturing same, and semiconductor device July 13, 2004
A silicone-based adhesive sheet prepared by a process comprising (i) curing a silicone composition to form a substantially cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur
6750550 Adhesive and semiconductor devices June 15, 2004
An adhesive composition for bonding semiconductor chips to their chip mounting components comprising a curable polymer composition comprising from 1 to 900 weight-ppm spherical filler having an average particle size of from 10 to 100 .mu.m and a major axis-to-minor axis ratio of from 1 t
6720083 Adhesive and semiconductor devices April 13, 2004
An adhesive composition for bonding of semiconductor chips to their chip mounting components comprising a curable polymer composition that comprises a spherical filler having an average particle size from greater than 100 to 1,000 .mu.m and an aspect ratio of 1 to 1.5. Semiconductor
6621173 Semiconductor device having an adhesive and a sealant September 16, 2003
A semiconductor device having a semiconductor chip; a semiconductor chip attachment element facing the semiconductor chip, at least one interconnect on the surface of the semiconductor chip attachment element; and at least one member consisting of a metal or metal alloy that electric
6551676 Silicone-based adhesive sheet method for manufacturing same and semiconductor device April 22, 2003
A silicone-based adhesive sheet prepared by a process comprising (i) curing a silicone composition to form a substantially cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur
6518204 Curable organopolysiloxane composition and method of manufacturing semiconductor devices with th February 11, 2003
A curable organopolysiloxane composition comprises: (A) an organopolysiloxane with two or more silicon-bonded hydrogen atoms contained in one molecule in an amount not exceeding 0.05 wt. %; (B) an organopolysiloxane with two or more alkenyl groups in one molecule {alkenyl groups of t
6498400 Semiconductor devices December 24, 2002
A semiconductor device comprising a semiconductor element; a substrate; and a hot-melt adhesive sheet bonding the semiconductor element to the substrate, wherein the hot-melt adhesive sheet comprises a spacer having the form of a sheet and a hot melt adhesive on both sides of the spacer.
6448175 Method for forming insulating thin films September 10, 2002
To provide a method for forming insulating thin films that can induce condensation of silanol and dehydration to a high degree at or near ambient pressure.An interlevel dielectric layer is formed on a semiconductor substrate by coating hydrogen silsesquioxane resin onto the substrate and
6447846 Electrically insulating thin-film-forming resin composition and method for forming thin film the September 10, 2002
An electrically insulating thin-film-forming resin composition comprising (A) a hydrogen silsesquioxane resin, (B) a solvent-soluble polymer, and (C) a solvent; and a method for forming an electrically insulating thin film therefrom.
6379792 Silicone adhesive sheet and method for manufacturing April 30, 2002
A silicone adhesive sheet for bonding a semiconductor chip to a chip attachment component comprising a crosslinkable silicone composition containing a silatrane derivative, and a method for manufacturing a silicone adhesive sheet by subjecting a crosslinkable silicone composition con
6358804 Semiconductor device and method for the fabrication thereof March 19, 2002
A method for forming thin films on substrates wherein the films are produced by applying a solution of an electrically insulating, heat-curing resin onto the substrate, evaporating the solvent and exposing the resin to high energy radiation to cure the resin. The resin solution contains
6304000 Semiconductor device comprising silicone adhesive sheet October 16, 2001
A semiconductor device comprising a semiconductor chip, a semiconductor chip attachment site facing the semiconductor chip, and an adhesive silicone sheet bonding the semiconductor chip to the chip attachment site, wherein at least the surfaces of the sheet that connect the semiconductor
6235862 Adhesive silicone sheet, method for the preparation thereof and semiconductor devices May 22, 2001
An adhesive silicone sheet that enroute to its complete cure is inhibited from releasing low-viscosity silicone oil, that provides excellent bond between a semiconductor chip and the corresponding chip attachment site, and that as a consequence of these features supports the fabrication
6231974 Hot-melt adhesive sheet and semiconductor devices May 15, 2001
To provides a hot-melt adhesive sheet that provides very precise bonding and a stress-relaxation capacity. Also, to provide highly reliable semiconductor devices in which the semiconductor element is bonded to its element attachment site using this hot-melt adhesive sheet.Hot-melt adhesi
6225433 Curable silicone composition and electronic components May 1, 2001
A curable silicon composition, comprising (A) 100 parts by weight of an organopolysiloxane containing silicon-bonded aryl groups and at least two alkenyl groups per molecule, and having a viscosity of from 0.01 to 1,000 Pa.s at 25.degree. C., wherein the aryl groups comprise from 1 to 40
6214748 Semiconductor device and method for the fabrication thereof April 10, 2001
This invention pertains to a method for forming thin films on substrates wherein the films are produced by applying a solution of an electrically insulating, heat-curing resin onto the substrate, evaporating the solvent and exposing the resin to high energy radiation to cure the resin. T
6149966 Composition and process for forming electrically insulating thin films November 21, 2000
To provide a composition and process for forming insulating films that can produce insulating films having low dielectric constants. The composition comprises (A) an electrically insulating curable inorganic or organic resin, (B) a solvent, and (C) at least one solvent-soluble substance
6074695 Composition and process for forming electrically insulating thin films June 13, 2000
To provide a composition for the formation of insulating films that can form an insulating film having a low dielectric constant. The composition comprises (A) an electrically insulating curable resin selected from the group consisting of electrically insulating curable organic resins an
6040395 Electrical components and method for the fabrication thereof March 21, 2000
This invention relates to a primer that improves adherence of a cured resin sealant to a cured silicone coating on an electrical element, wherein said primer is selected from the group consisting of:(i) a mixture of components (a) and (b),(ii) a reaction mixture of components (a) and (b),(ii
6040362 Heat-conducting polymer composition March 21, 2000
The present invention provides a heat-conducting polymer composition in which a heat-conducting metal powder is contained in a polymer, said heat-conducting polymer composition being characterized by the fact that the aforementioned powder is a metal powder which has a metal oxide layer
6039831 Electrically conductive silicone elastomer compositions, methods for manufacturing semiconductor March 21, 2000
A hydrosilylation curable electrically conductive silicone elastomer composition containing an acrylic functional group containing organopolysiloxane such that when the compositon is used to adhere a semiconductor chip to a substrate and the composition is then irradiated with a high
6025435 Thermal conductive silicone rubber composition February 15, 2000
A thermally conductive silicone rubber composition comprised of (A) 100 parts by weight of an organopolysiloxane that contains at least two silicon-bonded alkenyl groups per molecule, (B) 0.1 to 50 parts by weight of an organohydrogenpolysiloxane that contains at least two silicon-bonded
6017587 Electrically conductive silicone compositions January 25, 2000
The present invention relates to electrically conductive silicone compositions comprising an organopolysiloxane containing at least two alkenyl groups per molecule, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, a platinum group metal co
5989942 Method for fabricating semiconductor device November 23, 1999
A method for fabricating a semiconductor device, comprising the steps of coating the surface of a semiconductor element with a curable silicone composition comprising a curable silicone polymer and a filler having an average particle diameter of 0.01 to 500 micrometers and a specific
5982041 Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semicondu November 9, 1999
A silicone die attach adhesive comprising a silicone composition that cures both through the free radical reaction of acrylic-functional organopolysiloxane as induced by exposure to high-energy radiation and through the hydrosilylation reaction between alkenyl-functional organopolysi
5958515 Electrical components and method for the fabrication thereof September 28, 1999
This invention relates to a primer that improves adherence of a cured resin sealant to a cured silicone coating on an electrical element, wherein said primer is selected from the group consisting of:(i) a mixture of components (a) and (b),(ii) a reaction mixture of components (a) and (b),(ii
5958176 Electrical parts and method for manufacturing the same September 28, 1999
An electrical part containing an electrical element, a cured silicone resin which has been treated with ultraviolet light, a cured sealing resin which has been integrally bonded to the UV treated silicone resin. The cured silicone resin is prepared from an addition reaction curable silic
5932145 Addition reaction-curing electrically conductive silicone composition and method for the prepara August 3, 1999
An addition reaction-curing conductive silicone composition comprises: an organopolysiloxane with alkenyl groups, an organopolysiloxane with silicon-bonded hydrogen atoms, a conductive microparticulate, a platinum catalyst, and a volatile solvent; and the composition cures to yield a
5907190 Semiconductor device having a cured silicone coating with non uniformly dispersed filler May 25, 1999
A semiconductor device in which the surface of the semiconductor element is coated with a cured silicone in which there is dispersed filler having an average particle diameter of 0.01 to 500 micrometers and a specific gravity of 0.01 to 0.95 characterized in that the concentration of sai
5891969 Epoxy resin and epoxy-functional organopolysiloxane April 6, 1999
A curable epoxy resin composition comprising (A) a curable epoxy resin and (B) an organopolysiloxane prepared by equilibrium polymerization and having the average unit formulain which R.sup.1 is an epoxy-functional monovalent organic group, R.sup.2 is a monovalent hydrocarbon group, R.su
5872170 Electrically conductive silicone elastomer compositions, methods for manufacturing semiconductor February 16, 1999
A hydrosilylation curable electrically conductive silicone elastomer composition containing an acrylic functional group-containing organopolysiloxane such that when the composition is used to adhere a semiconductor chip to a substrate and the composition is then irradiated with a hig
5804631 Curable organosiloxane compositions and semiconductor devices September 8, 1998
A curable organosiloxane composition useable as a silicone die attach adhesive, an electrically conductive silicone rubber composition each comprising a composition that cures through both addition and condensation reactions, that will not impair wire bondability to a semiconductor chip
5708054 Two-part curable liquid silicone composition January 13, 1998
A two-part composition comprising a liquid composition (I) composed of the components (A), (C), and (E) described below and a liquid composition (II) composed of the components (A) (B), (C), and (D) described below, which yield upon mixing a curable liquid silicone composition comprising
5173765 Conductive adhesive and article made therewith December 22, 1992
A conductive adhesive for bonding semiconductor pellets to tabs is made from a conductive addition reaction-curing silicone rubber composition which contains.ltoreq.500 ppm of low-molecular-weight siloxane which has a vapor pressure.gtoreq.10 mmHg at 200.degree. C. The conductive adhesiv










 
 
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