| Patent Number |
Title Of Patent |
Date Issued |
| 7588992 |
Integrated thin-film capacitor with etch-stop layer, process of making same, and packages contai |
September 15, 2009 |
| A thin-film capacitor assembly includes a first metal bottom electrode, a dielectric layer, a second metal etch-stop layer, and a subsequent metal top electrode. The first metal bottom electrode is in contact with the dielectric layer. The second metal etch-stop layer is in contact with |
| 7572709 |
Method, apparatus, and system for low temperature deposition and irradiation annealing of thin f |
August 11, 2009 |
| Some embodiments of the invention include thin film capacitors formed in a package substrate of an integrated circuit package. At least one of the thin film capacitors includes a first electrode layer, a second electrode layer, and a dielectric layer between the first and second electrod |
| 7553738 |
Method of fabricating a microelectronic device including embedded thin film capacitor by over-et |
June 30, 2009 |
| A microelectronic device, a method of fabricating the device, and a system including the device. The method includes: providing a substrate including an underlying conductive layer and a polymer build-up layer overlying the underlying conductive layer; providing a passive microelectr |
| 7525140 |
Integrated thin film capacitors with adhesion holes for the improvement of adhesion strength |
April 28, 2009 |
| In an embodiment, a substrate includes a thin film capacitor embedded within. In an embodiment, a plurality of adhesion holes extend through the thin film capacitor. These adhesion holes may improve the adhesion of the capacitor to other portions of the substrate. |
| 7435675 |
Method of providing a pre-patterned high-k dielectric film |
October 14, 2008 |
| A method of forming a pre-patterned high-k dielectric film onto a support layer. The method includes: providing a support layer; providing a template defining template openings therein exhibiting a pattern that is a mirror image of a pattern of the pre-patterned high-k dielectric film; |
| 7416938 |
Inkjet patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, |
August 26, 2008 |
| An integrated thin-film capacitor includes a dielectric disposed between a first electrode and a second electrode. The thin-film capacitor includes a dielectric disposed upon the first electrode, and the dielectric exhibits a substantially uniform heat-altered morphology along a line |
| 7402909 |
Microelectronic package interconnect and method of fabrication thereof |
July 22, 2008 |
| A method of interconnecting and an interconnect is provided to connect a first component and a second component of an integrated circuit. The interconnect includes a plurality of Carbon Nanotubes (CNTs), which provide a conducting path between the first component and the second compo |
| 7290315 |
Method for making a passive device structure |
November 6, 2007 |
| A method including forming a ceramic material directly on a sheet of a first conductive material; forming a second conductive material on the ceramic material; and sintering the ceramic material. A method including forming a ceramic material directly on a sheet of a first conductive |
