Inventor:Meyer; James A.
No. of patents:1
||Title Of Patent
||Pressurized interconnection system for semiconductor chips
||February 18, 1992|
|A multilayer pressure stack (microstack) has a plurality of layers formed of a material that may have a high time-dependent deformation factor and a plurality of segments formed in each layer. Each segment comprises a conductive material having a low time-dependent deformation factor and|