Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Meyer; James A.
Address:
Campbell, CA
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
5089880 Pressurized interconnection system for semiconductor chips February 18, 1992
A multilayer pressure stack (microstack) has a plurality of layers formed of a material that may have a high time-dependent deformation factor and a plurality of segments formed in each layer. Each segment comprises a conductive material having a low time-dependent deformation factor and










 
 
  Recently Added Patents
System and method of verification of analog circuits
Magnetic detection of small entities
Method and apparatus for supporting delivery, sale and billing of perishable and time-sensitive goods such as newspapers, periodicals and direct marketing and promotional materials
Process for manufacturing a self-sealing composition
Method for manufacturing semiconductor device
Fuel cell with air channel actuator
Method of making a CIG target by spray forming
  Randomly Featured Patents
Guidewire tip construction
Concrete forming system and method
Ski pole
Hardware self-sorting scheduling queue
Multi-layer golf ball
Endohedral fullerenes having enclosed therein one or more ozone molecules, and their use as a UV-absorbing agent
Weapon system
Valve shaft support structure for variable intake manifold
Water dispersible acrylic based graft copolymers, a method of manufacture and aqueous paints
Synthesis of acyloxyalkyl carbamate prodrugs and intermediates thereof