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Inventor: Meyer; James A.
Address: Campbell, CA
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 5089880 |
Pressurized interconnection system for semiconductor chips |
February 18, 1992 |
| A multilayer pressure stack (microstack) has a plurality of layers formed of a material that may have a high time-dependent deformation factor and a plurality of segments formed in each layer. Each segment comprises a conductive material having a low time-dependent deformation factor and |
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