Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Meyer; James A.
Address:
Campbell, CA
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
5089880 Pressurized interconnection system for semiconductor chips February 18, 1992
A multilayer pressure stack (microstack) has a plurality of layers formed of a material that may have a high time-dependent deformation factor and a plurality of segments formed in each layer. Each segment comprises a conductive material having a low time-dependent deformation factor and










 
 
  Recently Added Patents
Canopy light fixture
Printed circuit board including electromagnetic bandgap structure
Method and system for presenting live video from video capture devices on a computer monitor
Electronic dispersion compensation within optical communications using reconstruction
Mobile device case with storage compartment
Radiation-curable ink composition, ink jet recording method, and recorded matter
Device and method for producing a fluidic connection between cavities
  Randomly Featured Patents
Bottle
Floor release latch mechanism for a vehicle seat interconnected with a secondary release associated with a rotatable seat back
Game board
Apparatus and method for reducing spurious currents in NMR imaging apparatus induced by pulsed gradient fields
Subtractive clustering for use in analysis of data
Multi-functional combination glass door handle lock
Compliance mechanism for manipulating a control object
Security fencing
Felt pen
Microwave and millimeter wave circuit including amplifier and band elimination filters