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Meyer; James A.
Campbell, CA
No. of patents:

Patent Number Title Of Patent Date Issued
5089880 Pressurized interconnection system for semiconductor chips February 18, 1992
A multilayer pressure stack (microstack) has a plurality of layers formed of a material that may have a high time-dependent deformation factor and a plurality of segments formed in each layer. Each segment comprises a conductive material having a low time-dependent deformation factor and

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