Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Meyer; James A.
Address:
Campbell, CA
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
5089880 Pressurized interconnection system for semiconductor chips February 18, 1992
A multilayer pressure stack (microstack) has a plurality of layers formed of a material that may have a high time-dependent deformation factor and a plurality of segments formed in each layer. Each segment comprises a conductive material having a low time-dependent deformation factor and










 
 
  Recently Added Patents
Reception method and reception apparatus
Bitter taste receptors
Methods and systems for automated backups and recovery on multi-os platforms using controller-based snapshots
Snapshots in de-duplication
Verbena plant named `Duempsopicha`
Multistable electromagnetic actuators
System and method for identifying a target signal in an optical transport network frame structure
  Randomly Featured Patents
Fast turn-off circuit arrangement
Neck and flange for soap cartridge
Method of producing cold rolled, silicon-alloyed electric sheets
Connector having an increased reliability and improved operation properties
Decontamination of RPET through particle size reduction
Sand motorcycle
Microelectromechanical systems type semiconductor gas sensor using microheater having many holes and method for manufacturing the same
Apparatus for lighting
Cam-actuated split ball valve
Brake control apparatus and method