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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Mehrabi; Ali
Address:
Glendale, CA
No. of patents:
4
Patents:












Patent Number Title Of Patent Date Issued
8067253 Electrical device and method of manufacturing electrical devices using film embossing techniques November 29, 2011
An electrical device and method of making same is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a thermoplastic material capable of deforming around the chip and at least partially encasing the chip when heat and/or pressure is app
7989313 Method and apparatus for creating RFID devices August 2, 2011
A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The soli
7560303 Method and apparatus for linear die transfer July 14, 2009
A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing a strap lead substrate having a plurality of strap leads disposed thereon; dispensing
7364983 Method and apparatus for creating RFID devices April 29, 2008
A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The soli










 
 
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