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Matthews; John C.
Gaithersburg, MD
No. of patents:

Patent Number Title Of Patent Date Issued
5071485 Method for photoresist stripping using reverse flow December 10, 1991
A method and apparatus for stripping a photoresist layer from a semiconductor wafer, wherein oxidizing gas is fed from the edge of the wafer to the center. The oxidizing gas may be directed so that it is incident on the heated wafer support platform before it is incident on the wafer
4885047 Apparatus for photoresist stripping December 5, 1989
An apparatus for rapidly stripping a photoresist which utilizes an oxidizing fluid such as ozone. A very thin layer of oxidizing fluid of four millimeters or less is flowed over the photoresist. The fluid flows at high velocity over the resist, while the resist is heated. Additionall

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