| Patent Number |
Title Of Patent |
Date Issued |
| 7888258 |
Forming method of electrode and manufacturing method of semiconductor device |
February 15, 2011 |
| A forming method of an electrode includes the steps of providing an electrode material on a conductive part; exposing the electrode material at a temperature equal to or higher than a melting point of the electrode material in an oxidizing atmosphere; and exposing the melted electrode |
| 6732911 |
Solder jointing system, solder jointing method, semiconductor device manufacturing method, and s |
May 11, 2004 |
| There is provided a chamber open to the outside through openings through which a solder-adhered object is passed and the chamber having a heating/melting area, a carrying mechanism for carrying the solder-adhered object into the heating/melting area, a formic-acid supplying means for |
| 6666369 |
Semiconductor device manufacturing method, electronic parts mounting method and heating/melting |
December 23, 2003 |
| There is provided a semiconductor device manufacturing method which comprising the steps of forming solder bumps on an underlying metal film of a semiconductor device, and placing the semiconductor device and the solder layer in a reduced pressure atmosphere containing a formic acid to |
| 6344407 |
Method of manufacturing solder bumps and solder joints using formic acid |
February 5, 2002 |
| A semiconductor device manufacturing method comprises the steps of forming solder bumps on an underlying metal film of a semiconductor device, and placing the semiconductor device and the solder layer in a reduced pressure atmosphere containing formic acid to form the solder bumps. A |
