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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Matsui; Hiroyuki
Address:
Kawasaki, JP
No. of patents:
4
Patents:












Patent Number Title Of Patent Date Issued
7888258 Forming method of electrode and manufacturing method of semiconductor device February 15, 2011
A forming method of an electrode includes the steps of providing an electrode material on a conductive part; exposing the electrode material at a temperature equal to or higher than a melting point of the electrode material in an oxidizing atmosphere; and exposing the melted electrode
6732911 Solder jointing system, solder jointing method, semiconductor device manufacturing method, and s May 11, 2004
There is provided a chamber open to the outside through openings through which a solder-adhered object is passed and the chamber having a heating/melting area, a carrying mechanism for carrying the solder-adhered object into the heating/melting area, a formic-acid supplying means for
6666369 Semiconductor device manufacturing method, electronic parts mounting method and heating/melting December 23, 2003
There is provided a semiconductor device manufacturing method which comprising the steps of forming solder bumps on an underlying metal film of a semiconductor device, and placing the semiconductor device and the solder layer in a reduced pressure atmosphere containing a formic acid to
6344407 Method of manufacturing solder bumps and solder joints using formic acid February 5, 2002
A semiconductor device manufacturing method comprises the steps of forming solder bumps on an underlying metal film of a semiconductor device, and placing the semiconductor device and the solder layer in a reduced pressure atmosphere containing formic acid to form the solder bumps. A










 
 
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