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Inventor: Machida; Koichi
Address: Kanagawa, JP
No. of patents: 3
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 5266654 |
Resin composition |
November 30, 1993 |
| A resin composition for sealing semiconductors which comprises an organic component (A) which contains (a) a polymaleimide compound represented by the formula (I): ##STR1## wherein R.sub.1 is a m-valent organic group having two or more carbon atoms and m is an integer of two or m |
| 5120803 |
Resin compositions for sealing semiconductor |
June 9, 1992 |
| A resin composition for sealing semiconductors which comprises (a) a modified epoxy resin composed of (i) an epoxy resin having a specific structure or a graft polymer of an epoxy resin having a specific structure and a vinyl polymer and (ii) a silicone polymer in oily state or as pa |
| 5082880 |
Semiconductor sealing composition containing epoxy resin and polymaleimide |
January 21, 1992 |
| A resin composition for sealing semiconductors which comprises (a) an epoxy resin having a specific structure, a modified epoxy resin composed of (i) an epoxy resin having a specific structure or a graft polymer of an epoxy resin having a specific structure and a vinyl polymer and (ii) a |
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