| Patent Number |
Title Of Patent |
Date Issued |
| 7626251 |
Microelectronic die assembly having thermally conductive element at a backside thereof and metho |
December 1, 2009 |
| A microelectronic die assembly. The die assembly includes a microelectronic die, and a thermally conductive element attached to the backside of the die with a thermal interface material. The thermally conductive element has lateral dimensions smaller than, substantially equal to, or |
| 7564066 |
Multi-chip assembly with optically coupled die |
July 21, 2009 |
| Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the substrates. At least one die on one of the substrates is in optical communication with at least |
| 7554203 |
Electronic assembly with stacked IC's using two or more different connection technologies and me |
June 30, 2009 |
| An integrated circuit ("IC") package having two or more dice stacked on a substrate and electrically coupled using two or more different connection technologies may improve high-speed input/output ("I/O") bandwidth. In an embodiment, one die is a processor and at least one other die is a |
| 7553386 |
Adhesive with differential optical properties and its application for substrate processing |
June 30, 2009 |
| An adhesive adapted with particular optical properties, and its use to couple a substrate to a substrate holder during substrate processing are disclosed. After processing the substrate, the optical properties of the adhesive may be exploited to locate and/or remove adhesive residue that |
| 7538019 |
Forming compliant contact pads for semiconductor packages |
May 26, 2009 |
| In one embodiment, the present invention includes a semiconductor package having a substrate with a first surface to support a semiconductor die. A second surface of the substrate includes compliant conductive pads to provide electrical connections to the semiconductor die. In this way, |
| 7535689 |
Reducing input capacitance of high speed integrated circuits |
May 19, 2009 |
| An integrated circuit with reduced pad capacitance, having a trench formed in the silicon substrate below the pad to reduce the pad capacitance. In another embodiment, an encapsulated air cavity is formed underneath the pad. |
| 7534715 |
Methods including fluxless chip attach processes |
May 19, 2009 |
| Electronic devices and methods for fabricating electronic devices are described. One method includes providing a plurality of first metal bumps on a first surface, and a plurality of second metal bumps on a second surface, wherein at least one of (i) the plurality of first metal bumps, |
| 7518238 |
Mounting flexible circuits onto integrated circuit substrates |
April 14, 2009 |
| A substrate may receive an integrated circuit and a flex circuit on the same side in the same vertical direction. In addition, in some embodiments, a flex circuit adapter and the integrated circuit may be surface mounted in one operation. |
| 7507604 |
Breakable interconnects and structures formed thereby |
March 24, 2009 |
| Methods of forming a microelectronic structure are described. Embodiments of those methods include placing an anisotropic conductive layer comprising at least one compliant conductive sphere on at least one interconnect structure disposed on a first substrate, applying pressure to co |
| 7504318 |
Nanopowder coating for scribing and structures formed thereby |
March 17, 2009 |
| Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a conformal layer of a water soluble nanopowder on a wafer, and then scribing the wafer. |
| 7476568 |
Wafer-level assembly of heat spreaders for dual IHS packages |
January 13, 2009 |
| An embodiment of the present invention is a technique to fabricate a package. A heat spreader (HS) array on a HS support substrate is formed. The HS array has a plurality of heat spreaders. A diced wafer supported by a wafer support substrate (WSS) is formed. The diced wafer has a pl |
| 7435664 |
Wafer-level bonding for mechanically reinforced ultra-thin die |
October 14, 2008 |
| An embodiment of the present invention is a technique to fabricate a package. A metal sheet having trenches is formed. A thinned wafer supported by a wafer support substrate (WSS) is formed. The metal sheet is bonded to the WSS-supported thinned wafer to form a metal bonded thinned w |
| 7432592 |
Integrated micro-channels for 3D through silicon architectures |
October 7, 2008 |
| Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures. |
| 7407085 |
Apparatus and method for attaching a semiconductor die to a heat spreader |
August 5, 2008 |
| Embodiments of an apparatus and method for attaching a semiconductor die to a heat spreader (or other thermal component) are disclosed. The apparatus includes a substantially flat surface to receive a number of die, and the die may be held in place on the surface by a flux, the flux |
| 7393468 |
Adhesive with differential optical properties and its application for substrate processing |
July 1, 2008 |
| An adhesive adapted with particular optical properties, and its use to couple a substrate to a substrate holder during substrate processing are disclosed. After processing the substrate, the optical properties of the adhesive may be exploited to locate and/or remove adhesive residue that |
| 7373033 |
Chip-to-chip optical interconnect |
May 13, 2008 |
| A chip-to-chip optical interconnect includes a substrate, an optoelectronic die, and a waveguide structure. The substrate includes an optical via passing through the substrate. The optoelectronic die is disposed on the substrate and aligned to optically communicate through the optica |
| 7372120 |
Methods and apparatus to optically couple an optoelectronic chip to a waveguide |
May 13, 2008 |
| Methods and apparatus to optically couple an optoelectronic chip to a waveguide are disclosed. A disclosed apparatus includes a substrate, a waveguide mounted on the substrate and an optoelectronic chip bonded to the substrate and having an optical element directly engaging the waveg |
| 7348678 |
Integrated circuit package to provide high-bandwidth communication among multiple dice |
March 25, 2008 |
| A system may include a microprocessor die, an integrated circuit package substrate, and a die disposed between the microprocessor die and the integrated circuit package substrate. In some embodiments, the integrated circuit package substrate defines a first cavity, and the die is dispose |
| 7344383 |
Split socket optical interconnect |
March 18, 2008 |
| A split microprocessor socket is disclosed that provides a cavity created at an outer edge of the microprocessor socket. An optical module may be fitted in the cavity thus providing an optical fiber or waveguide connection directly to the socket. This low cost optical interconnect, c |
| 7344318 |
Optical interconnect with passive optical alignment |
March 18, 2008 |
| A coupler is passively aligned over a substrate, wherein the coupler is laterally aligned to an optoelectronic (OE) device coupled to the substrate. The coupler is placed on the substrate, wherein the coupler is vertically aligned to the OE device. The coupler is fixed to the substra |
| 7334946 |
Passively aligned optical-electrical interface with microlenses |
February 26, 2008 |
| An optical-electrical interface for interfacing optical signals with electrical signals. The optical-electrical interface includes an alignment interface for receiving an external waveguide connector from a first side. The alignment interface includes an alignment structure to mate w |
| 7319048 |
Electronic assemblies having a low processing temperature |
January 15, 2008 |
| Embodiments relate to electronic assemblies and methods for forming electronic assemblies. One method includes providing a die and a copper heat spreader that are to be coupled to one another through a thermal interface material. A layer of tin is formed on the copper heat spreader. |
| 7303944 |
Microelectronic devices having underfill materials with improved fluxing agents |
December 4, 2007 |
| Microelectronic packages formed by using novel fluxing agents are disclosed. In one aspect, a microelectronic package may include a microelectronic device, a substrate, and an interconnect structure including a solder material coupling the microelectronic device with the substrate. U |
| 7288438 |
Solder deposition on wafer backside for thin-die thermal interface material |
October 30, 2007 |
| A solder is deposited on the backside of a wafer. The wafer can be pre-deposited with a barrier layer such as a titanium base and other materials. Deposition is carried out by electroplating, electroless plating, chemical vapor deposition, and physical vapor deposition. The solder-de |
| 7283699 |
Optical package |
October 16, 2007 |
| Optical packages are disclosed. In one aspect, an optical package may include a surface, a microelectronic device coupled with the surface, a first waveguide coupled with the microelectronic device, a second waveguide having a first end that is evanescently coupled with the first wav |
| 7279720 |
Large bumps for optical flip chips |
October 9, 2007 |
| The invention provides bumps between a die and a substrate with a height greater than or equal to a height of a waveguide between the die and the substrate. The bumps may be formed on a die prior to that die being singulated from a wafer. |
| 7279362 |
Semiconductor wafer coat layers and methods therefor |
October 9, 2007 |
| Formulations and processes for forming wafer coat layers are disclosed. In one embodiment, an organic surface protectant is incorporated into a wafer coat formulation deposited onto a semiconductor wafer prior to the laser scribe operation. Upon removal of the wafer coat layer, the organ |
| 7279359 |
High performance amine based no-flow underfill materials for flip chip applications |
October 9, 2007 |
| Amine-based no-flow underfill materials and a method to produce flip-chip devices electrically bonded to a substrate are described. The no-flow underfill material includes an amine-based curing agent and a fluxing agent, which activates at a fluxing temperature and is neutral at the |
| 7256059 |
Underfill integration for optical packages |
August 14, 2007 |
| The application discloses an apparatus comprising an optical die flip-chip bonded to a substrate and defining a volume between the optical die and the substrate, the optical die including an optically active area on a surface of the die facing the substrate, an optically transparent |
| 7251389 |
Embedded on-die laser source and optical interconnect |
July 31, 2007 |
| An apparatus and method for embedding a laser source on a semiconductor substrate and an optical interconnect to couple the laser source to internal components of the semiconductor substrate. An on-die waveguide is integrated on the semiconductor substrate. A package waveguide is dis |
| 7238605 |
Circuit structures and methods of forming circuit structures with minimal dielectric constant la |
July 3, 2007 |
| An apparatus including a contact point formed on a device layer of a circuit substrate or an interconnect layer on the substrate; a first dielectric material; and a different second polymerizable dielectric material on the substrate and separated from the device layer or the intercon |
| 7236666 |
On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-subst |
June 26, 2007 |
| Optical apparatus, methods of forming the apparatus, and methods of using the apparatus are disclosed herein. In one aspect, an optical apparatus may include a substrate, an on-substrate microlens coupled with the substrate to receive light from an off-substrate light emitter and focus |
| 7226812 |
Wafer support and release in wafer processing |
June 5, 2007 |
| Methods and apparatuses for wafer support and release using sacrificial materials in wafer processing. In one embodiment, a solution of a sacrificial polymer is spray-coated on the wafer bump side to form a thin layer of the sacrificial polymer after solvent vaporization. An adhesive |
| 7220622 |
Method for attaching a semiconductor die to a substrate and heat spreader |
May 22, 2007 |
| Disclosed are embodiments of a method of attaching a die to a substrate and a heat spreader to the die in a single heating operation. A number of conductive bumps extending from the die may also be reflowed during this heating operation. Other embodiments are described and claimed. |
| 7195941 |
Optical devices and methods to construct the same |
March 27, 2007 |
| Optical devices and methods for constructing the same are disclosed. An example optical device includes an optical transmitter, a photodetector and a waveguide optically coupling the optical transmitter and the photodetector. It also includes a substrate having a first cavity to rece |
| 7177504 |
Manufacturable connectorization process for optical chip-to-chip interconnects |
February 13, 2007 |
| An apparatus comprising a substrate having a trench therein, the trench extending to an edge of the substrate, a waveguide array positioned in the trench, the waveguide array extending to the edge of the substrate, and a ferrule attached at or near the edge of the substrate and spanning |
| 7153765 |
Method of assembling soldered packages utilizing selective solder deposition by self-assembly of |
December 26, 2006 |
| A nano-sized solder suspension flows by selective wetting onto a bond pad and away from a bond-pad resist area. A microelectronic package is also disclosed that uses the nano-sized solder suspension. A method of assembling a microelectronic package is also disclosed. A computing syst |
| 7085449 |
Waveguide coupling mechanism |
August 1, 2006 |
| A system is disclosed. The system includes an external waveguide and an IC coupled to the external waveguide. The IC includes at least two lenses and a second waveguide. The lenses couple radiant energy from the external waveguide to the second waveguide. |
| 7068892 |
Passively aligned optical-electrical interface |
June 27, 2006 |
| An optical-electrical interface includes an alignment interface and an optoelectronic die. The alignment interface is mounted to a substrate and includes a waveguide port to receive an external waveguide from a first side. The alignment interface includes a conductor disposed on a second |
| 7061099 |
Microelectronic package having chamber sealed by material including one or more intermetallic co |
June 13, 2006 |
| Microelectronic packages having chambers and sealing materials, and methods of making the packages, and sealing the chambers, are disclosed. An exemplary package may include a first surface, a second surface, a solid sealing material including an intermetallic compound, such as, for |
| 7059045 |
Method for handling integrated circuit die |
June 13, 2006 |
| In some embodiments, a method includes picking up a clip with a chuck, and, while holding the clip with the chuck, picking up an integrated circuit (IC) die with the IC die in contact with the clip. |
| 7045452 |
Circuit structures and methods of forming circuit structures with minimal dielectric constant la |
May 16, 2006 |
| An apparatus including a contact point formed on a device layer of a circuit substrate or an interconnect layer on the substrate; a first dielectric material; and a different second polymerizable dielectric material on the substrate and separated from the device layer or the intercon |
| 7042106 |
Underfill integration for optical packages |
May 9, 2006 |
| The application discloses an apparatus comprising an optical die flip-chip bonded to a substrate and defining a volume between the optical die and the substrate, the optical die including an optically active area on a surface of the die facing the substrate, an optically transparent |
| 7038316 |
Bumpless die and heat spreader lid module bonded to bumped die carrier |
May 2, 2006 |
| An IC package is assembled from a bumpless die, a die carrier having a plurality of solder bumps thereon, and a heat spreader lid. The bumpless die is bonded to the heat spreader lid to form a module and then the module is bonded to the bumped die carrier. |
| 7026376 |
Fluxing agent for underfill materials |
April 11, 2006 |
| An underfill material, such as a no flow underfill material, containing an anhydride adduct of a rosin compound is disclosed. In one aspect, the anhydride adduct of a rosin compound contains an organic rosin acid moiety and a substitute moiety for a hydroxyl group of a carboxylic acid |
| 7023089 |
Low temperature packaging apparatus and method |
April 4, 2006 |
| Some embodiments disclose a low temperature semiconductor packaging apparatus and method. An apparatus generally comprises a heat spreader, a silicon die, and a thermal interface material disposed between the heat spreader and the silicon die comprising a plurality of metals capable of |
| 7009289 |
Fluxless die-to-heat spreader bonding using thermal interface material |
March 7, 2006 |
| A thinned semiconductor die is coupled to an integrated heat spreader with thermal interface material to form a semiconductor package. The method for forming the package comprises forming a metallization layer on a backside of a thinned semiconductor die. A thermal interface portion, |
| 6933171 |
Large bumps for optical flip chips |
August 23, 2005 |
| The invention provides bumps between a die and a substrate with a height greater than or equal to a height of a waveguide between the die and the substrate. The bumps may be formed on a die prior to that die being singulated from a wafer. |
| 6834133 |
Optoelectronic packages and methods to simultaneously couple an optoelectronic chip to a wavegui |
December 21, 2004 |
| Optoelectronic packages and methods to simultaneously couple an optoelectronic chip to a waveguide and substrate using conventional flux soldering processes are disclosed. A disclosed optoelectronic package includes a substrate, a waveguide mounted on the substrate, an optoelectronic |
| 6833289 |
Fluxless die-to-heat spreader bonding using thermal interface material |
December 21, 2004 |
| A thinned semiconductor die is coupled to an integrated heat spreader with thermal interface material to form a semiconductor package. The method for forming the package comprises forming a metallization layer on a backside of a thinned semiconductor die. A thermal interface portion, inc |
