| Patent Number |
Title Of Patent |
Date Issued |
| 7554197 |
High frequency IC package and method for fabricating the same |
June 30, 2009 |
| A high frequency IC package mainly includes a substrate, a bumped chip, and a plurality of conductive fillers where the substrate has a plurality of bump holes penetrating from the top surface to the bottom surface. The active surface of the chip is attached to the top surface of the |
| 7477065 |
Method for fabricating a plurality of elastic probes in a row |
January 13, 2009 |
| A method of forming a plurality of elastic probes in a row is disclosed. Firstly, a substrate is provided, then, a shaping layer is formed on the substrate so as to offer two flat surfaces in parallel. A photoresist layer is formed on the substrate and on the shaping layer. Then, the |
| 7420267 |
Image sensor assembly and method for fabricating the same |
September 2, 2008 |
| An assembly device of an image sensor chip is disclosed. A flexible circuit has a die-attached portion, a plurality of bendable portions, and a plurality of bonding portions where the bendable portions extend from the die-attached portion and are connected to the corresponding bonding |
| 7372286 |
Modular probe card |
May 13, 2008 |
| A modular probe card comprises a printed circuit board, an interposer, and a probe head where the printed circuit board has a plurality of first contact pads, the probe head has a plurality of second contact pads. The interposer is disposed between the printed circuit board and the probe |
| 7372135 |
Multi-chip image sensor module |
May 13, 2008 |
| A multi-chip image sensor module includes a flexible module board, an image sensor chip, a transparent cover, and at least an IC chip. The flexible module board has a first die-attached portion, a second die-attached portion, at least one bent portion, and at least one bonding portio |
| 7370416 |
Method of manufacturing an injector plate |
May 13, 2008 |
| A method of manufacturing an injector plate is provided where a wafer is provided and a release layer is disposed on the wafer. Then a photo resist is formed over the release layer. After photolithography processing, a plurality of plugs are formed from the photo resist. A titanium l |
| 7368809 |
Pillar grid array package |
May 6, 2008 |
| A pillar grid array package (PGA) includes a substrate, a chip disposed on top of the substrate, and a plurality of stud bumps disposed on bottom of the substrate. The stud bumps are formed in an array and each has a flattened top to electrically connect to a printed circuit board, PCB, |
| 7316065 |
Method for fabricating a plurality of elastic probes in a row |
January 8, 2008 |
| A method of forming a plurality of elastic probes in a row is disclosed. Firstly, a substrate is provided, then, a shaping layer is formed on the substrate so as to offer two flat surfaces in parallel. A photoresist layer is formed on the substrate and on the shaping layer. Then, the |
| 7140101 |
Method for fabricating anisotropic conductive substrate |
November 28, 2006 |
| A method for fabricating an anisotropic conductive substrate is disclosed. A back holder has metal pins on a surface thereof. A liquid compound is formed on the surface of the back holder with metal pins. The liquid compound is pressed to deform the metal pins into electrodes in the |
| 7129730 |
Probe card assembly |
October 31, 2006 |
| A modularized probe head assembly mainly includes a probe head, an interposer and a probe head carrier with guide pins. The probe head has a plurality of first through holes. The interposer has a plurality of second through holes corresponding in location to the first through holes. |
| 7088118 |
Modularized probe card for high frequency probing |
August 8, 2006 |
| A modularized probe head for high frequency probing is provided. The probe head mainly includes a probe head, a mounting board and an interposer between the probe head and the mounting board. The probe head has a plurality of cavities on its back surface. A plurality of decoupling co |
| 7005054 |
Method for manufacturing probes of a probe card |
February 28, 2006 |
| A method to make probes of a probe card includes providing a blocking plate on an electroplating tank. The blocking plate has a plurality of openings according to the layout of contact pads on a probe head. There are bumps on the contact pads of the probe head. Continuous electroplat |
| 6946860 |
Modularized probe head |
September 20, 2005 |
| A modularized probe head for modularly assembling on a probe card is configured for probing a semiconductor wafer under test. The probe head includes a silicon substrate having an active surface and an opposing back surface. The back surface of the silicon substrate is attached on a |
| 6812720 |
Modularized probe card with coaxial transmitters |
November 2, 2004 |
| A modularized probe card with coaxial transmitter is disclosed. At least a coaxial transmitter is modularized and installed between a first printed circuit board and a second printed circuit board. The coaxial transmitter has a first connector and a second connector correspondingly conne |
| 6781392 |
Modularized probe card with compressible electrical connection device |
August 24, 2004 |
| A modularized probe card comprising an interface board, a probe head and at least a compressible electrical connection device is disclosed. The compressible electrical connection device comprises an insulation layer with a plurality of circuits on one of its surface. Two ends of each |
| 6751760 |
Method and system for performing memory repair analysis |
June 15, 2004 |
| A method and a system for performing memory repair analysis are provided. A merge circuit is connected between test storage device of semiconductor testing equipment and pre-analysis storage device of repair analysis apparatus. Prior to memory repair analysis process, data from a plurali |
| 6686615 |
Flip-chip type semiconductor device for reducing signal skew |
February 3, 2004 |
| A flip chip type semiconductor device for reducing signal skew includes: a chip with bonding pads, and a plurality of bumping pads on the chip. Between each bonding pad and corresponding bumping pads is connected with a metal redistribution trace covered by a passivation layer. Each meta |
| 6621710 |
Modular probe card assembly |
September 16, 2003 |
| A modular probe card assembly comprises a silicon substrate with probes modularly assembled on a main board. At least a socket is installed around silicon substrate and electrically connects to probe needles by a flexible printed wiring film. A plurality of detachable coaxial wires elect |
| 6605480 |
Wafer level packaging for making flip-chips |
August 12, 2003 |
| A wafer level packaging process for making flip-chips and integrated circuits formed are proposed. The process comprises in turn, providing a wafer, forming a protective material, bumping the wafer, removing the protective material, probing the wafer, laser repairing, and dicing the |
| 6534853 |
Semiconductor wafer designed to avoid probed marks while testing |
March 18, 2003 |
| A semiconductor wafer is disclosed for avoiding probed marks while testing. The wafer has a plurality of metal interconnects, each metal interconnect connecting underlying bonding pad, corresponding contact pad and test pad. Each contact pad being outer electrical connection terminal is |
| 6395622 |
Manufacturing process of semiconductor devices |
May 28, 2002 |
| A manufacturing process of semiconductor devices comprises providing at least a wafer, bumping the wafer, testing the wafer, laser repairing, and dicing. The step of testing one bumped wafer is contained after bumping and before laser repairing in order to shorten the procedures and incr |
