Resources Contact Us Home Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE     Inventor: Lin; Yeong-Jyh Address: Tainan, TW No. of patents: 1 Patents: Patent Number Title Of Patent Date Issued 7554197 High frequency IC package and method for fabricating the same June 30, 2009 A high frequency IC package mainly includes a substrate, a bumped chip, and a plurality of conductive fillers where the substrate has a plurality of bump holes penetrating from the top surface to the bottom surface. The active surface of the chip is attached to the top surface of the       Recently Added Patents Successive-convolution-compositing technique for rendering translucent surfaces Cotton variety 05Y063 Electrical switch Non-volatile memory devices and methods of programming the same Flat soft magnetic metal powder and composite magnetic material including the soft magnetic metal powder Control device for data stream optimizations in a link interface Facial osteodistraction device   Randomly Featured Patents Apparatus for recording a digital video signal Semiconductor memory device for providing burst mode control signal, device comprising plural serial transition registers Mattress sling Out-of-order load/store execution control Semiconductor read-only VLSI memory Automatic medical sampling device Distributed processing systems having a host processor and at least two object oriented processors which communicate directly with each other Steel plate excellent in brittle crack propagation arrest characteristics and low temperature toughness and process for producing same Apparatus and method for interfacing indirect-fire devices with MILES Method and apparatus of translating and executing native code in a virtual machine environment © 2006. PatentGenius. All Rights Reserved.