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Inventor: Lin; Tsang-Jung
Address: Chungli, TW
No. of patents: 4
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 6218320 |
Method for improving the uniformity of wafer-to-wafer film thickness |
April 17, 2001 |
| A method for improving the uniformity of wafer-to-wafer film thicknesses. Before depositing films, shower heads in a PECVD system is heated to production temperature to make the entire system (including the shower heads) reach a stable temperature in coordination with heating of a heater |
| 6211060 |
Method for planarizing a damascene structure |
April 3, 2001 |
| A method for planarizing a damascence structure, comprises using two polishing procedure to remove the redundant metal layer. The method comprises depositing a dielectric layer over a wafer. A photolithography and etching procedure is then performed to form trenchs on the dielectric |
| 6132078 |
Slurry providing system |
October 17, 2000 |
| A slurry providing system, located between a main slurry providing system and a CMP machine, includes a providing barrel, which can either be used as a buffer tank to provide slurry to the CMP machine with interruption, or as an independent backup tank for store slurry. The providing bar |
| 6077147 |
Chemical-mechanical polishing station with end-point monitoring device |
June 20, 2000 |
| A chemical-mechanical polishing station for polishing wafers. The polishing station comprises a slurry supplier, a polishing pad capable of collecting the slurry, and a polishing head capable of rotating a wafer and lowering the wafer onto the polishing pad in contact with the polishing |
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