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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Lin; Kevin K.
Address:
Apopka, FL
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
7635636 Wafer level packaging of materials with different coefficients of thermal expansion December 22, 2009
An electro-mechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate
7109635 Wafer level packaging of materials with different coefficients of thermal expansion September 19, 2006
An electro-mechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate










 
 
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