Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Lin; Jyh-Rong
Address:
Tucheng, TW
No. of patents:
9
Patents:












Patent Number Title Of Patent Date Issued
8587091 Wafer-leveled chip packaging structure and method thereof November 19, 2013
A wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the firs
7879438 Substrate warpage-reducing structure February 1, 2011
The subject matter disclosed herein relates to methods to reduce warpage of a substrate.
7838333 Electronic device package and method of manufacturing the same November 23, 2010
The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic device package with enhanced electrical performance and heat-dissipation efficiency are
7632707 Electronic device package and method of manufacturing the same December 15, 2009
The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic device package with enhanced electrical performance and heat-dissipation efficiency are
7572676 Packaging structure and method of an image sensor module August 11, 2009
This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an image sensor integrated circuit chip having a photosensitive active area and at least o
7528009 Wafer-leveled chip packaging structure and method thereof May 5, 2009
This invention relates to a wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating la
7411306 Packaging structure and method of an image sensor module August 12, 2008
This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an image sensor integrated circuit chip having a photosensitive active area and at least o
7294920 Wafer-leveled chip packaging structure and method thereof November 13, 2007
This invention relates to a wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating la
6605525 Method for forming a wafer level package incorporating a multiplicity of elastomeric blocks and August 12, 2003
A method for forming a wafer level package incorporating a multiplicity of elastomeric blocks as stress buffering layer and package formed are described. The method incorporates the step of forming metal lines in-between the plurality of IC dies on a wafer during the same process use










 
 
  Recently Added Patents
System and method of detecting and locating intermittent and other faults
Efficient forward ranking in a search engine
Stable light source device
Light irradiation element, image forming structure, and image forming apparatus
Image display device and display unit for image display device
Mobile terminal
Liquid-level sensor
  Randomly Featured Patents
Method of forming a head suspension with an integral boss tower
Method for recycling household waste
Scaler tip
Lighter
Electrophotographic method for production of plural images on a sheet
Dram cell with three-sided-gate transfer device
Process for treating partially desulfurized coke
Ignition control device for internal combustion engine
Substrate attach adhesive film, application method and devices incorporating the same
Connector with double lock mechanism