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Inventor: Lin; Chun-Hung
Address: Tainan, TW
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7554197 |
High frequency IC package and method for fabricating the same |
June 30, 2009 |
| A high frequency IC package mainly includes a substrate, a bumped chip, and a plurality of conductive fillers where the substrate has a plurality of bump holes penetrating from the top surface to the bottom surface. The active surface of the chip is attached to the top surface of the |
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