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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Lien; Chung-Cheng
Address:
Hsinchu, TW
No. of patents:
9
Patents:












Patent Number Title Of Patent Date Issued
8256106 Method for fabricating circuit board structure with capacitors embedded therein September 4, 2012
A circuit board structure with capacitors embedded therein and a method for fabricating the same are disclosed. The structure comprises at least two core layers individually comprising a dielectric layer having two opposite surfaces, circuit layers disposed on the outsides of the two
7863729 Circuit board structure embedded with semiconductor chips January 4, 2011
A circuit board structure embedded with semiconductor chips is proposed. A semiconductor chip is received in a cavity of a supporting board. A dielectric layer and a circuit layer are formed on the supporting board and the semiconductor chip. A plurality of hollow conductive vias are
7706148 Stack structure of circuit boards embedded with semiconductor chips April 27, 2010
A stack structure of circuit boards embedded with semiconductor chips is proposed. At least two circuit boards are provided. Each of the circuit boards includes circuit layers formed on surfaces thereof and at least one opening embedded with a semiconductor chip, wherein, the circuit
7674986 Circuit board structure having capacitor array and embedded electronic component and method for March 9, 2010
A circuit board structure having a capacitor array and an embedded electronic component and a method for fabricating the same are proposed. Two carrier boards and a high dielectric constant material layer are provided, wherein the carrier boards have electronic components embedded th
7656040 Stack structure of circuit board with semiconductor component embedded therein February 2, 2010
A stack structure of circuit boards embedded with semiconductor components therein is proposed, which includes at least two semiconductor components embedded circuit boards, a plurality of conductive bumps, and at least one adhesive layer. The circuit boards are each formed with a circui
7619317 Carrier structure for semiconductor chip and method for manufacturing the same November 17, 2009
A carrier structure for a semiconductor chip and a method for manufacturing the same are disclosed. The method includes the following steps: providing a carrier board having at least one through cavity, wherein a removable film is formed on the surface of the carrier board, and a sem
7598610 Plate structure having chip embedded therein and the manufacturing method of the same October 6, 2009
A plate structure having a chip embedded therein, comprises an aluminum plate having at least one aluminum oxide layer formed on its surface, and a cavity therein; a chip embedded in the cavity, wherein the chip has an active surface; at least one electrode pad mounted on the active surf
7514770 Stack structure of carrier board embedded with semiconductor components and method for fabricati April 7, 2009
A stack structure of a carrier board embedded with semiconductor components and a method for fabricating the same are proposed. The stack structure includes first and second carrier boards having a through hole respectively, first and second semiconductors component disposed in throu
7507915 Stack structure of carrier boards embedded with semiconductor components and method for fabricat March 24, 2009
A stack structure of carrier boards embedded with semiconductor components and a method for fabricating the same are proposed. A first carrier board and a second carrier board, each of which having at least one through hole, are provided. A first protecting layer and a second protecting










 
 
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