| |
|
Inventor: Liao; Chih-Chin
Address: Changhwa Hsien, TW
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 6392425 |
Multi-chip packaging having non-sticking test structure |
May 21, 2002 |
| A multi-chip packaging substrate having a non-sticking test structure consists of a plurality of non-sticking test spots formed in the periphery zone outside the chip-packaging zone of a multi-chip packaging substrate. Each of these non-sticking test spots is electrically connected to an |
| 6391666 |
Method for identifying defective elements in array molding of semiconductor packaging |
May 21, 2002 |
| The present invention is a method for identifying defective elements in array molding of semiconductor packaging for mini BGA packaging substrate which comprises a circuit zone and a periphery zone. The method of the present invention is first to form a plurality of package sites dispose |
|
|
|
