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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Lewis; Theron Lee
Address:
Rochester, MN
No. of patents:
4
Patents:












Patent Number Title Of Patent Date Issued
7632127 Socket and method for compensating for differing coefficients of thermal expansion December 15, 2009
The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated ho
7530853 Socket and method for compensating for differing coefficients of thermal expansion May 12, 2009
The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an el
7472477 Method for manufacturing a socket that compensates for differing coefficients of thermal expansi January 6, 2009
The illustrative embodiments provide a method for manufacturing a socket and attaching the socket to a printed circuit board. Surface mounted contacts for a bottom surface of a socket are provided. The surface mounted contacts are a plurality of conductive metal pads that directly at
7303443 Socket and method for compensating for differing coefficients of thermal expansion December 4, 2007
The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an el










 
 
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