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Inventor: Lewis; Theron Lee
Address: Rochester, MN
No. of patents: 4
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7632127 |
Socket and method for compensating for differing coefficients of thermal expansion |
December 15, 2009 |
| The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated ho |
| 7530853 |
Socket and method for compensating for differing coefficients of thermal expansion |
May 12, 2009 |
| The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an el |
| 7472477 |
Method for manufacturing a socket that compensates for differing coefficients of thermal expansi |
January 6, 2009 |
| The illustrative embodiments provide a method for manufacturing a socket and attaching the socket to a printed circuit board. Surface mounted contacts for a bottom surface of a socket are provided. The surface mounted contacts are a plurality of conductive metal pads that directly at |
| 7303443 |
Socket and method for compensating for differing coefficients of thermal expansion |
December 4, 2007 |
| The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an el |
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