| Patent Number |
Title Of Patent |
Date Issued |
| 7622377 |
Microfeature workpiece substrates having through-substrate vias, and associated methods of forma |
November 24, 2009 |
| Microfeature workpiece substrates having through-substrate vias, and associated methods of formation are disclosed. A method in accordance with one embodiment for forming a support substrate for carrying microfeature dies includes exposing a support substrate to an electrolyte, with |
| 7612436 |
Packaged microelectronic devices with a lead frame |
November 3, 2009 |
| Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The |
| 7569473 |
Methods of forming semiconductor assemblies |
August 4, 2009 |
| Apparatus and methods are disclosed relating to semiconductor assemblies. A semiconductor assembly includes an interposer which may be constructed from a flexible material, such as a polyimide tape. A pattern of conductive traces disposed on a first surface of the interposer is in el |
| 7553699 |
Method of fabricating microelectronic devices |
June 30, 2009 |
| Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. An embodiment of one such method includes forming a plurality of through holes in a substrate with the through holes arranged in arrays, and attaching a plurality of singulated microel |
| 7534660 |
Methods for assembly and packaging of flip chip configured dice with interposer |
May 19, 2009 |
| A method for assembly and packaging of one or more flip chip-configured semiconductor dice with an interposer substrate to form a flip chip-type semiconductor device assembly. The flip chip-type semiconductor device assembly includes a conductively bumped semiconductor die and an int |
| 7531906 |
Flip chip packaging using recessed interposer terminals |
May 12, 2009 |
| A method and apparatus for packaging a semiconductor die with an interposer substrate. A semiconductor device assembly includes a conductively bumped semiconductor die and an interposer substrate having multiple recesses formed therein. The semiconductor die is mounted to the interpo |
| 7521794 |
Intrinsic thermal enhancement for FBGA package |
April 21, 2009 |
| A semiconductor device for dissipating heat generated by a die during operation and having a low height profile, a semiconductor die package incorporating the device, and methods of fabricating the device and package are provided. In one embodiment, the semiconductor device comprises |
| 7494889 |
Method of manufacturing an interposer including at least one passive element at least partially |
February 24, 2009 |
| An interposer for assembly with a semiconductor die and methods of manufacture are disclosed. The interposer may include at least one passive element at least partially defined by at least one recess formed in at least one dielectric layer of the interposer. The at least one recess m |
| 7459346 |
Intrinsic thermal enhancement for FBGA package |
December 2, 2008 |
| A semiconductor device for dissipating heat generated by a die during operation and having a low height profile, a semiconductor die package incorporating the device, and methods of fabricating the device and package are provided. In one embodiment, the semiconductor device comprises |
| 7422978 |
Methods of manufacturing interposers with flexible solder pad elements |
September 9, 2008 |
| Various embodiments of an interposer for mounting a semiconductor die, as well as methods for forming the interposer, are disclosed. The interposer includes flexible solder pad elements that are formed from a core material of the interposer, such that the interposer may absorb thermally |
| 7397129 |
Interposers with flexible solder pad elements |
July 8, 2008 |
| Various embodiments of an interposer for mounting a semiconductor die, as well as methods for forming the interposer, are disclosed. The interposer includes flexible solder pad elements that are formed from a core material of the interposer, such that the interposer may absorb thermally |
| 7354795 |
Methods for packaging and encapsulating semiconductor device assemblies that include tape substr |
April 8, 2008 |
| Packaging and encapsulation methods include use of a tape substrate with a mold gate that includes an aperture and a support element that extends over at least a portion of the aperture. The tape substrate may be part of a strip. A semiconductor device is secured and electrically connect |
| 7348215 |
Methods for assembly and packaging of flip chip configured dice with interposer |
March 25, 2008 |
| A method for assembly and packaging of one or more flip chip-configured semiconductor dice with an interposer substrate to form a flip chip-type semiconductor device assembly. The flip chip-type semiconductor device assembly includes a conductively bumped semiconductor die and an int |
| 7320933 |
Double bumping of flexible substrate for first and second level interconnects |
January 22, 2008 |
| An apparatus and method for improving the yield and reducing the cost of forming a semiconductor device assembly. An interposer substrate is formed with interconnections in the form of conductive bumps on both a first surface and a second surface to provide a respective first level i |
| 7294911 |
Ultrathin leadframe BGA circuit package |
November 13, 2007 |
| A circuit package is formed using a leadframe. The leadframe is formed or etched to align a plurality of bond pad structures above a reference plane while supporting leadframe fingers are positioned below the reference plane. Jumper wires are wirebonded between terminals on the die a |
| 7250687 |
Systems for degating packaged semiconductor devices with tape substrates |
July 31, 2007 |
| A system for degating a packaged semiconductor device that includes a tape substrate includes a first element and a second element. The first element of the system is positionable adjacent to a first major surface of the packaged semiconductor device and includes a receptacle for rec |
| 7230330 |
Semiconductor die packages with recessed interconnecting structures |
June 12, 2007 |
| Apparatus and methods relating to semiconductor assemblies. A semiconductor assembly includes an interposer which may be constructed from a flexible material, such as a polyimide tape. A pattern of conductive traces disposed on a first surface of the interposer is in electrical commu |
| 7190081 |
Mold gates and tape substrates including the mold gates |
March 13, 2007 |
| A mold gate of a tape substrate includes an aperture formed in the flexible dielectric film of the tape substrate and a support element which is carried by a surface of the flexible dielectric film. The aperture of the mold gate may be formed by die cutting or etching processes. The |
| 7189593 |
Elimination of RDL using tape base flip chip on flex for die stacking |
March 13, 2007 |
| A flexible film interposer for stacking a flip chip semiconductor die onto a second (bottom) semiconductor die, semiconductor devices and stacked die assemblies that incorporate the flexible film interposer, and methods of fabricating the devices and assemblies are provided. The incorpor |
| 7183134 |
Ultrathin leadframe BGA circuit package |
February 27, 2007 |
| A circuit package is formed using a leadframe. The leadframe is formed or etched to align a plurality of bond pad structures above a reference plane while supporting leadframe fingers are positioned below the reference plane. Jumper wires are wirebonded between terminals on the die a |
| 7161237 |
Flip chip packaging using recessed interposer terminals |
January 9, 2007 |
| A method and apparatus for packaging a semiconductor die with an interposer substrate. The semiconductor device assembly includes a conductively bumped semiconductor die and an interposer substrate having multiple recesses formed therein. The semiconductor die is mounted to the inter |
| 7145225 |
Interposer configured to reduce the profiles of semiconductor device assemblies and packages inc |
December 5, 2006 |
| An interposer includes a substrate, first and second sets of contact pads carried by the substrate, and receptacles formed in a surface of the substrate and exposing contact pads of the second set. The interposer may also include conductive traces carried by the substrate to electrically |
| 7138711 |
Intrinsic thermal enhancement for FBGA package |
November 21, 2006 |
| A semiconductor device for dissipating heat generated by a die during operation and having a low height profile, a semiconductor die package incorporating the device, and methods of fabricating the device and package are provided. In one embodiment, the semiconductor device comprises |
| 7129584 |
Elimination of RDL using tape base flip chip on flex for die stacking |
October 31, 2006 |
| A flexible film interposer for stacking a flip chip semiconductor die onto a second (bottom) semiconductor die, semiconductor devices and stacked die assemblies that incorporate the flexible film interposer, and methods of fabricating the devices and assemblies are provided. The incorpor |
| 7122907 |
Interposer substrate and wafer scale interposer substrate member for use with flip-chip configur |
October 17, 2006 |
| A method and apparatus for increasing the integrated circuit density in a flip chip semiconductor device assembly and decreasing the time for dielectrically filling such assembly using less dielectric material. The semiconductor device assembly includes a conductively bumped semicond |
| 7112520 |
Semiconductor die packages with recessed interconnecting structures and methods for assembling t |
September 26, 2006 |
| Apparatus and methods relating to semiconductor assemblies. A semiconductor assembly includes an interposer which may be constructed from a flexible material, such as a polyimide tape. A pattern of conductive traces disposed on a first surface of the interposer is in electrical commu |
| 7112048 |
BOC BGA package for die with I-shaped bond pad layout |
September 26, 2006 |
| Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die |
| 7105918 |
Interposer with flexible solder pad elements and methods of manufacturing the same |
September 12, 2006 |
| Various embodiments of an interposer for mounting a semiconductor die, as well as methods for forming the interposer, are disclosed. The interposer includes flexible solder pad elements that are formed from a core material of the interposer, such that the interposer may absorb thermally |
| 7087994 |
Microelectronic devices including underfill apertures |
August 8, 2006 |
| Supports (40) of microelectronic devices (10) are provided with underfill apertures (60) which facilitate filling underfill gaps (70) with underfill material (74). The underfill aperture may have a longer first dimension (62) and a shorter second dimension (64). In some embodiments, |
| 7087460 |
Methods for assembly and packaging of flip chip configured dice with interposer |
August 8, 2006 |
| A method for assembly and packaging of one or more flip chip-configured semiconductor dice with an interposer substrate to form a flip chip-type semiconductor device assembly. The flip chip-type semiconductor device assembly includes a conductively bumped semiconductor die and an int |
| 7057297 |
Tape substrates with mold gate support structures that are coplanar with conductive traces there |
June 6, 2006 |
| A mold gate of a tape substrate includes an aperture formed in the flexible dielectric film of the tape substrate and a support element which is carried by a surface of the flexible dielectric film, is substantially coplanar with conductive traces carried by the flexible dielectric f |
| 7005316 |
Method for package reduction in stacked chip and board assemblies |
February 28, 2006 |
| A method and apparatus for assembling semiconductor die-carrying interposer substrates in a stacked configuration. Each interposer substrate bears at least one die mounted by its active surface to a surface of the interposer substrate and wire bonded to terminals on the opposing subs |
| 6975035 |
Method and apparatus for dielectric filling of flip chip on interposer assembly |
December 13, 2005 |
| A method and apparatus for increasing the integrated circuit density in a flip chip semiconductor device assembly and decreasing the time for dielectrically filling such assembly using less dielectric material. The semiconductor device assembly includes a conductively bumped semiconducto |
| 6940179 |
Innovative solder ball pad structure to ease design rule, methods of fabricating same and substr |
September 6, 2005 |
| A solder ball pad is provided for mounting and connecting of electronic devices and, more particularly, apparatus and methods are disclosed providing an improved solder ball pad structure on a substrate, such as a printed circuit board ("PCB") or a semiconductor die, while enabling b |
| 6787917 |
Apparatus for package reduction in stacked chip and board assemblies |
September 7, 2004 |
| An electronic device package having semiconductor die-carrying interposer substrates in a stacked configuration. Each interposer substrate bears at least one die mounted by its active surface to a surface of the interposer substrate and wire bonded to terminals on the opposing substrate |
| 6762503 |
Innovative solder ball pad structure to ease design rule, methods of fabricating same and substr |
July 13, 2004 |
| A solder ball pad for mounting and connecting of electronic devices and, more particularly, apparatus and methods providing an improved solder ball pad structure on a substrate, such as a printed circuit board ("PCB") or a semiconductor die, while enabling better use of the spaces betwee |
| 6756251 |
Method of manufacturing microelectronic devices, including methods of underfilling microelectron |
June 29, 2004 |
| Supports (40) of microelectronic devices (10) are provided with underfill apertures (60) which facilitate filling underfill gaps (70) with underfill material (74). The underfill aperture may have a longer first dimension (62) and a shorter second dimension (64). In some embodiments, a me |
| 6720666 |
BOC BGA package for die with I-shaped bond pad layout |
April 13, 2004 |
| Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die |
| 6692987 |
BOC BGA package for die with I-shaped bond pad layout |
February 17, 2004 |
| Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die |
| 6583502 |
Apparatus for package reduction in stacked chip and board assemblies |
June 24, 2003 |
| A method and apparatus for assembling semiconductor die-carrying interposer substrates in a stacked configuration. Each interposer substrate bears at least one die mounted by its active surface to a surface of the substrate and wire bonded to terminals on the opposing substrate surface t |
