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Lee; Jung-Kuk
Yongin-si, KR
No. of patents:

Patent Number Title Of Patent Date Issued
8125236 Main board and system for memory mounting test February 28, 2012
A main board according to example embodiments may include a substrate and at least one socket. The at least one socket may directly connect a memory module to the substrate in a direction parallel to the substrate. A memory mounting test system including the main board may occupy a s
7979760 Test system for conducting parallel bit test July 12, 2011
Provided is a test system conducting a parallel bit test. The test system, conducting a parallel bit test on a plurality of memory modules mounted on a socket, comprises a plurality of counters and a comparator. Each of the counters counts the number of data output signals in the same
7814379 Memory module packaging test system October 12, 2010
A memory module packaging test system may include a plurality of test slots into which a plurality of memory modules may be installed so that the system may simultaneously test the memory modules. The memory module packaging test system may use a server system for a registered dual i
7606110 Memory module, memory unit, and hub with non-periodic clock and methods of using the same October 20, 2009
A memory module, a memory unit, and a hub with a non-periodic clock and methods for using the same. An example memory module may include a phased locked loop, receiving an external, periodic clock and generating one or more internal periodic clocks and a plurality of memory units, receiv
7487413 Memory module testing apparatus and method of testing memory modules February 3, 2009
A memory module testing apparatus and method include a test slot adapted to receive a target memory module, wherein the target memory module includes a first memory unit to store information related to the target memory module. The memory module testing apparatus further includes a s
7319635 Memory system with registered memory module and control method January 15, 2008
A memory module and related method are disclosed. The memory module comprises a clock generator configured to generate first and second internal clock signals in relation to an external clock signal, and a register configured to receive the first and second internal clock signals. Th
7233157 Test board for high-frequency system level test June 19, 2007
A test board for a high-frequency system level test: The test board includes a main board having through holes filled with a conductive material. These holes may be located at a portion of the main board from which an existing module socket has been removed. An interface board has su

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