| Patent Number |
Title Of Patent |
Date Issued |
| 4692839 |
Multiple chip interconnection system and package |
September 8, 1987 |
| A multiple chip interconnection system and package for interconnecting and cooling integrated circuits includes an electrically-conductive plate 10 having an upper surface 12. On the upper surface 12, a first layer of polyimide 16 or other electrically-insulating material is deposited. O |
| 4667220 |
Semiconductor chip module interconnection system |
May 19, 1987 |
| A module for a semiconductor chip having a front face with a two dimensional array of power, ground and signal contacts is disclosed. Power, ground and signal conductors extend from the respective contacts on the front face of the chip. A pair of electrically conductive plates are pa |
| 4667219 |
Semiconductor chip interface |
May 19, 1987 |
| A semiconductor chip module for a semiconductor chip having an exposed front face with a two dimensional array of contacts is disclosed. A connector plate is located proximate the front face of the chip. The connector plate has a plurality of apertures which correspond to and are ali |
| 4603345 |
Module construction for semiconductor chip |
July 29, 1986 |
| A module for a semiconductor chip is disclosed. The module includes a heat sink with a flat surface to which the back face of the semiconductor chip is directly bonded. The exposed face of the chip has an array of power, ground and signal contacts. A plurality of alternating power and gr |
| 4597029 |
Signal connection system for semiconductor chip |
June 24, 1986 |
| A semiconductor chip having a two-dimensional array of contacts on an exposed face thereof is mounted in a semiconductor chip module. A mechanism for delivering electricity spans the exposed face of the chip to which it is connected and includes interstitial gaps. A conductor board h |
