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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Lee; Jae-Seob
Address:
Suwon-si, KR
No. of patents:
4
Patents:












Patent Number Title Of Patent Date Issued
8221889 Flexible substrate, method of fabricating the same, and thin film transistor using the same July 17, 2012
A flexible substrate for a TFT includes a metal substrate having a predetermined coefficient of thermal expansion, and a buffer layer on the metal substrate, the buffer layer including a silicon oxide or a silicon nitride, wherein the predetermined coefficient of thermal expansion of
8187960 Method of joining and method of fabricating an organic light emitting diode display device using May 29, 2012
A method of joining a flexible layer and a support includes forming a first metal layer on one surface of the flexible layer, forming a second metal layer on one surface of the support, cleaning the first metal layer and the second metal layer, and joining the first metal layer to the
8119250 Flexible substrate, method of fabricating the same, and thin film transistor using the same February 21, 2012
A flexible substrate for a TFT includes a metal substrate having a predetermined coefficient of thermal expansion, and a buffer layer on the metal substrate, the buffer layer including a silicon oxide or a silicon nitride, wherein the predetermined coefficient of thermal expansion of
8016628 Method of joining and method of fabricating an organic light emitting diode display device using September 13, 2011
A method of joining a flexible layer and a support includes forming a first metal layer on one surface of the flexible layer, forming a second metal layer on one surface of the support, cleaning the first metal layer and the second metal layer, and joining the first metal layer to the










 
 
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