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Inventor: Lee; Jae-Seob
Address: Suwon-si, KR
No. of patents: 4
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 8221889 |
Flexible substrate, method of fabricating the same, and thin film transistor using the same |
July 17, 2012 |
| A flexible substrate for a TFT includes a metal substrate having a predetermined coefficient of thermal expansion, and a buffer layer on the metal substrate, the buffer layer including a silicon oxide or a silicon nitride, wherein the predetermined coefficient of thermal expansion of |
| 8187960 |
Method of joining and method of fabricating an organic light emitting diode display device using |
May 29, 2012 |
| A method of joining a flexible layer and a support includes forming a first metal layer on one surface of the flexible layer, forming a second metal layer on one surface of the support, cleaning the first metal layer and the second metal layer, and joining the first metal layer to the |
| 8119250 |
Flexible substrate, method of fabricating the same, and thin film transistor using the same |
February 21, 2012 |
| A flexible substrate for a TFT includes a metal substrate having a predetermined coefficient of thermal expansion, and a buffer layer on the metal substrate, the buffer layer including a silicon oxide or a silicon nitride, wherein the predetermined coefficient of thermal expansion of |
| 8016628 |
Method of joining and method of fabricating an organic light emitting diode display device using |
September 13, 2011 |
| A method of joining a flexible layer and a support includes forming a first metal layer on one surface of the flexible layer, forming a second metal layer on one surface of the support, cleaning the first metal layer and the second metal layer, and joining the first metal layer to the |
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