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Inventor:
Lee; Harry Q.
Address:
Mountain View, CA
No. of patents:
14
Patents:












Patent Number Title Of Patent Date Issued
7255632 Chemical mechanical polishing system having multiple polishing stations and providing relative l August 14, 2007
A polishing method usable in an apparatus including a rotatable member rotatable about a first axis, at least one substrate head assembly supported on said rotatable member, and at least two polishing surfaces arranged below said rotatable member at respective angular positions about
7238090 Polishing apparatus having a trough July 3, 2007
Methods and apparatus for chemical mechanical polishing are described. In one embodiment, an apparatus includes a table top and a transfer station and multiple polishing stations are mounted on the table top. The apparatus further includes multiple washing stations, where each washing
7097544 Chemical mechanical polishing system having multiple polishing stations and providing relative l August 29, 2006
An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes polishing surfaces located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the number of polishing stations, can be loaded with
6126517 System for chemical mechanical polishing having multiple polishing stations October 3, 2000
An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes a polishing surfaces, such as pads mounted on respective platens, located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the num
6080046 Underwater wafer storage and wafer picking for chemical mechanical polishing June 27, 2000
A wafer storage and wafer transfer system adjunct to a multi-station chemical mechanical polishing system. Multiple wafers are brought to the system stored in a cassette. A claw member attached to an overhead arm picks up the cassette and deposits it in a water-filled tub next to the
5804507 Radially oscillating carousel processing system for chemical mechanical polishing September 8, 1998
An apparatus for polishing semiconductor wafers and other workpieces that includes a polishing pads mounted on respective platens at multiple polishing stations. Multiple wafer heads, at least one greater in number than the number of polishing stations, can be loaded with individual
5795215 Method and apparatus for using a retaining ring to control the edge effect August 18, 1998
A process using a retaining ring assembly of a carrier head to precompress a polishing pad to reduce or minimize the edge effect in a chemical mechanical polishing process.
5738574 Continuous processing system for chemical mechanical polishing April 14, 1998
An apparatus for polishing semiconductor wafers and other workpieces that includes polishing pads mounted on respective platens at multiple polishing stations. Multiple wafer heads, at least one greater in number than the number of polishing stations, can be loaded with individual wa
5681215 Carrier head design for a chemical mechanical polishing apparatus October 28, 1997
A carrier uses multiple bellows to form two pressure chambers between the housing and carrier base and retaining ring assembly. By pressurizing the first chamber, an even load can be applied across the substrate. By pressurizing the second chamber, the retaining ring can pressed against
5599423 Apparatus and method for simulating and optimizing a chemical mechanical polishing system February 4, 1997
Apparatus and concomitant method for simulating a chemical mechanical polishing (CMP) system containing a polishing pad, a chuck for supporting a substrate, a positioner for positioning the polishing pad with respect to the substrate, a chuck rotator for rotating the chuck, and a polishi
5497007 Method for automatically establishing a wafer coordinate system March 5, 1996
An automated method for establishing a wafer coordinate system for a wafer characterization system. Specifically, under computer control, a high-magnification imaging system images a wafer at a low, initial magnification level. From this imaging process, the method first determines t
5422724 Multiple-scan method for wafer particle analysis June 6, 1995
A method for reducing targeting errors encountered when trying to locate contaminant particles in a high-magnification imaging device, based on estimates of the particle positions obtained from a scanning device. The method of the invention includes scanning a semiconductor wafer in a
5381004 Particle analysis of notched wafers January 10, 1995
A method for reducing targeting errors that arise when trying to locate contaminant particles on a notched semiconductor wafer using a high-magnification imaging device, based on estimates of wafer feature positions obtained from a scanning device. The present invention scans a notch
5267017 Method of particle analysis on a mirror wafer November 30, 1993
A method for reducing targeting errors encountered when trying to locate contaminant particles in a high-magnification imaging device, based on estimates of the particle positions obtained from a scanning device. The method of the invention uses three techniques separately and in com










 
 
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