Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Lee; Cheng-Hui
Address:
Hsin Chu, TW
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
6614660 Thermally enhanced IC chip package September 2, 2003
A thermally enhanced IC chip package has a dielectric substrate member with conductive circuit patterns on top and bottom surfaces thereof and an opening therethrough. An IC chip having active and inactive sides is received in the opening. The active side of the chip and the top surface










 
 
  Recently Added Patents
Vehicle control apparatus
Portable, single member housing cord protector
Method for treating wounds for mammals, wound healer compound, and method of manufacturing thereof
System for and method of providing single sign-on (SSO) capability in an application publishing environment
Polyfunctional sulfur-containing epoxies and compositions thereof
Frame syncrhonization in orthogonal frequency-division multiplexing systems
Techniques for accessing a parallel database system via external programs using vertical and/or horizontal partitioning
  Randomly Featured Patents
Image transfer device having laminated lens array sheets
Electrical multilayer component with shielding and resistance structures
Tape processing apparatus, tag label producing apparatus, tag assembly, and tape processing method
Semiconductor device, and manufacturing method therefor
Plum tree (Black Noble)
Mobile isolation glove box with disposable enclosure for investigations
Method for drilling with casing
Method for repairing manholes or wetwalls
Stable, sterically-protected, bonded phase silicas prepared from bifunctional silanes
Method for solution phase synthesis of oligonucleotides and peptides