Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Lee; Cheng-Hui
Address:
Hsin Chu, TW
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
6614660 Thermally enhanced IC chip package September 2, 2003
A thermally enhanced IC chip package has a dielectric substrate member with conductive circuit patterns on top and bottom surfaces thereof and an opening therethrough. An IC chip having active and inactive sides is received in the opening. The active side of the chip and the top surface










 
 
  Recently Added Patents
Identifying multi-component carrier cells
Semiconductor assembly and semiconductor package including a solder channel
Measurement and uses of oxidative status
Hard disk drives having different rotational speeds
Air scent dispenser
Process for production of nickel oxide-stabilized zirconia composite oxide
Cross-linkable compositions
  Randomly Featured Patents
Methods and compositions for treating neuropathies
Method for the fast recognition of objects likely to form part of a collection comprising a large number of objects with different characteristics
Temperature control and monitoring of optical detector components in an optical communication system
Faucet spout
Method and assembly for sealing articles
Method and apparatus for cleaning & rinsing carpets
Advertising sign
Safety shut off valve for gas cylinders
Azabicyclo [3.1.0] hexylphenyl derivatives as modulators of dopamine D3 receptors
Combustion gas seal assembly adapted for a fuel injector