Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Lee; Cheng-Hui
Address:
Hsin Chu, TW
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
6614660 Thermally enhanced IC chip package September 2, 2003
A thermally enhanced IC chip package has a dielectric substrate member with conductive circuit patterns on top and bottom surfaces thereof and an opening therethrough. An IC chip having active and inactive sides is received in the opening. The active side of the chip and the top surface










 
 
  Recently Added Patents
Identification of electrical grid phase information for end-points in a grid network
All-angle light emitting element having high heat dissipating efficiency
Chemical method of making a suspension, emulsion or dispersion of pyrithione particles
Vehicle battery with cell balancing current paths and method of charging the same
Systems and methods for providing power and data to lighting devices
Image signal processing apparatus and image signal processing method
Cabinet door with tread pattern
  Randomly Featured Patents
Halogenated supports and supported activators
Conveyor for articles with wave-shaped rollers
Method of manufacturing cold-rolled can steel sheet having less planar anisotropy and good workability
Safety switch for communication device
Control mechanism for automatically operated warp beams with automatic setting
Expression of a foamy virus envelope protein
Detector and method for observation of the presence of a liquid and/or of a change of phase in same
Joint timing recovery for multiple signal channels
Gaseous fuel direct injection system for internal combustion engines
Thermally stable chromium-exchanged zeolites and method of making same