Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Lee; Cheng-Hui
Address:
Hsin Chu, TW
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
6614660 Thermally enhanced IC chip package September 2, 2003
A thermally enhanced IC chip package has a dielectric substrate member with conductive circuit patterns on top and bottom surfaces thereof and an opening therethrough. An IC chip having active and inactive sides is received in the opening. The active side of the chip and the top surface










 
 
  Recently Added Patents
Optical article comprising a temporary anti-fogging coating with improved durability
Organic light emitting device connection methods
Polishing composition
Storage basket with lid
Method and apparatus for controlling the use of data stored on a media sample
In-store marketing sign
Enhancing user experiences using aggregated device usage data
  Randomly Featured Patents
Dispersion of fine particles of modified polyethylene and process for preparation thereof
Expandable medical device with beneficial agent delivery mechanism
Reinforcing members for tilting sash type window system
Dynamic advertisement insertion methods and systems
Method for intrastromal photodisruption of dome-shaped surfaces
Image decoder with bus arbitration circuit
Antimigraine derivatives of indolylcycloalkanylamines
Battery pack having a communicator for communicating with electric device and electric device using the same
Logical paging areas
L-Aspartyl dipeptides as sweetening agents