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Lee; Cheng-Hui
Hsin Chu, TW
No. of patents:

Patent Number Title Of Patent Date Issued
6614660 Thermally enhanced IC chip package September 2, 2003
A thermally enhanced IC chip package has a dielectric substrate member with conductive circuit patterns on top and bottom surfaces thereof and an opening therethrough. An IC chip having active and inactive sides is received in the opening. The active side of the chip and the top surface

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