| Patent Number |
Title Of Patent |
Date Issued |
| RE38716 |
Automatic visual inspection system |
March 22, 2005 |
| A binary map of an object having edges is produced by first producing a digital grey scale image of the object with a given resolution, and processing the grey scale image to produce a binary map of the object at a resolution greater than said given resolution. Processing of the grey |
| 7454052 |
Pixel based machine for patterned wafers |
November 18, 2008 |
| A method is provided for the detection of defects on a semiconductor wafer by checking individual pixels on the wafer, collecting the signature of each pixel, defined by the way in which it responds to the light of a scanning beam, and determining whether the signature is that of a f |
| 7016526 |
Pixel based machine for patterned wafers |
March 21, 2006 |
| A method is provided for the detection of defects on a semiconductor wafer by checking individual pixels on the wafer, collecting the signature of each pixel, defined by the way in which it responds to the light of a scanning beam, and determining whether the signature is that of a f |
| 6810139 |
Pixel based machine for patterned wafers |
October 26, 2004 |
| A method is provided for the detection of defects on a semiconductor wafer by checking individual pixels on the wafer, collecting the signature of each pixel, defined by the way in which it responds to the light of a scanning beam, and determining whether the signature is that of a f |
| 6366690 |
Pixel based machine for patterned wafers |
April 2, 2002 |
| A method is provided for the detection of defects on a semiconductor wafer by checking individual pixels on the wafer, collecting the signature of each pixel, defined by the way in which it responds to the light of a scanning beam, and determining whether the signature is that of a f |
| 4758888 |
Method of and means for inspecting workpieces traveling along a production line |
July 19, 1988 |
| Inspection of workpieces traveling along a production line includes on-line inspection of the workpieces at an upstream inspection station to detect possible flaws without interrupting the progression of workpieces along the production line. Possible flaws in the inspected workpieces are |
