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Inventor: Kwon; Yong-hwan
Address: Suwon-si, KR
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7569423 |
Wafer-level-chip-scale package and method of fabrication |
August 4, 2009 |
| A wafer-level-chip-scale package and related method of fabrication are disclosed. The wafer-level-chip-scale package comprises a semiconductor substrate comprising an integrated circuit, a conductive ball disposed on the semiconductor substrate and electrically connected to the integrate |
| 7554201 |
Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same |
June 30, 2009 |
| Example embodiments of the present invention relate to an alloy solder and a semiconductor device using the alloy solder. Other example embodiments relate to an alloy solder capable of increasing reliability of a junction between a semiconductor chip and a substrate. According to still I |
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