| Patent Number |
Title Of Patent |
Date Issued |
| 8138266 |
Semiconductor-encapsulating resin composition and semiconductor device |
March 20, 2012 |
| A semiconductor-encapsulating resin composition includes a curing agent and a compound (A) having a plurality of glycidyl ether groups. When ion viscosity of the resin composition is measured under conditions of a measurement temperature of about 175.degree. C. and a measurement freq |
| 8117881 |
Press-molding method and press-molding device |
February 21, 2012 |
| A press-molding device (80) press molds a bottom portion of a work piece (9) having a closed-end shape between an, inner die (521) inserted into the work piece (9) and an outer die (551) disposed on an outside of the work piece (9). A chuck position switching mechanism (501) grips the wo |
| 8092612 |
Cooling method and cooling device |
January 10, 2012 |
| A cooling device (70) for cooling a work piece (9) that has reached a high temperature due to the implementation of a closing operation in which a bottom portion (9c) is formed by closing an end portion of the tubular work piece (9) comprises a tilting mechanism (151) which tilts the |
| 7696286 |
Semiconductor encapsulant of epoxy resin, polyphenolic compound, filler and accelerator |
April 13, 2010 |
| A resin composition for semiconductor encapsulation contains an epoxy resin (A); a phenolic compound (B) containing two or more phenolic hydroxyl groups; an inorganic filler (C); and a curing accelerator (D). The epoxy resin (A) contains an epoxy resin (a1) represented by the formula |
| 7671146 |
Epoxy resin composition for encapsulating semiconductor and semiconductor device |
March 2, 2010 |
| This invention provides an epoxy resin composition for encapsulating a semiconductor exhibiting higher flame resistance, good flowability and adequately higher solder-reflow resistance to allow for the use of a lead-free solder without a flame retardant, as well as a highly reliable |
| 7157313 |
Epoxy resin composition and semiconductor device using thereof |
January 2, 2007 |
| The present invention provides an epoxy resin composition for packaging a semiconductor device, characterized in having improved mold releasability during a molding process, continuous-moldability and improved solder resistance. According to the present invention, there is provided an |
