Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Kuroda; Hirofumi
Address:
Tokyo, JP
No. of patents:
6
Patents:












Patent Number Title Of Patent Date Issued
8138266 Semiconductor-encapsulating resin composition and semiconductor device March 20, 2012
A semiconductor-encapsulating resin composition includes a curing agent and a compound (A) having a plurality of glycidyl ether groups. When ion viscosity of the resin composition is measured under conditions of a measurement temperature of about 175.degree. C. and a measurement freq
8117881 Press-molding method and press-molding device February 21, 2012
A press-molding device (80) press molds a bottom portion of a work piece (9) having a closed-end shape between an, inner die (521) inserted into the work piece (9) and an outer die (551) disposed on an outside of the work piece (9). A chuck position switching mechanism (501) grips the wo
8092612 Cooling method and cooling device January 10, 2012
A cooling device (70) for cooling a work piece (9) that has reached a high temperature due to the implementation of a closing operation in which a bottom portion (9c) is formed by closing an end portion of the tubular work piece (9) comprises a tilting mechanism (151) which tilts the
7696286 Semiconductor encapsulant of epoxy resin, polyphenolic compound, filler and accelerator April 13, 2010
A resin composition for semiconductor encapsulation contains an epoxy resin (A); a phenolic compound (B) containing two or more phenolic hydroxyl groups; an inorganic filler (C); and a curing accelerator (D). The epoxy resin (A) contains an epoxy resin (a1) represented by the formula
7671146 Epoxy resin composition for encapsulating semiconductor and semiconductor device March 2, 2010
This invention provides an epoxy resin composition for encapsulating a semiconductor exhibiting higher flame resistance, good flowability and adequately higher solder-reflow resistance to allow for the use of a lead-free solder without a flame retardant, as well as a highly reliable
7157313 Epoxy resin composition and semiconductor device using thereof January 2, 2007
The present invention provides an epoxy resin composition for packaging a semiconductor device, characterized in having improved mold releasability during a molding process, continuous-moldability and improved solder resistance. According to the present invention, there is provided an










 
 
  Recently Added Patents
Method to improve fuel cell system performance using cell voltage prediction of fuel cell stack
Swirler for gas turbine engine fuel injector
Multifunction measuring device
Method and apparatus for spawning specialist belief propagation networks
Cement composition and process for producing cement composition
Picocell system with local voice media support
Method and system for validating video apparatus in an active environment
  Randomly Featured Patents
Process for producing trans-4-hydroxy-L-proline
Polo box therapeutic compositions, methods, and uses therefor
Fan blade with curved planform and high-lift airfoil having bulbous leading edge
Aircraft moving device
Solvent-free preparation of gun propellant formulations
Radiation-hardened silicon-on-insulator CMOS device, and method of making the same
Pelham bit
Film slitter, film and film slitting method
Energy management for hybrid electric vehicle during trailer sway
System and method for noise reduction using bi-orthogonal modified discrete cosine transform