| Patent Number |
Title Of Patent |
Date Issued |
| 7589955 |
Electric double layer capacitor and aggregation thereof |
September 15, 2009 |
| An electric double layer capacitor includes an anode, a cathode, and an electrolytic solution provided between the anode and the cathode. The anode may be a niobium porous sintered body with an oxide film formed as a dielectric layer on a surface thereof. The cathode allows an electric |
| 7551424 |
Solid electrolytic capacitor |
June 23, 2009 |
| A solid electrolytic capacitor (A1) includes a first and a second porous sintered bodies (1). Each sintered body (1) is flat, with its thickness being small relative to the width or the length. The first and the second sintered bodies (1) are spaced from each other in the widthwise or |
| 7511944 |
Solid electrolytic capacitor and method for manufacturing same |
March 31, 2009 |
| A solid electrolytic capacitor (A1) includes a porous sintered body (1) of valve metal, and a metal case (2) accommodating the porous sintered body. The metal case (2) and the porous sintered body (1) are electrically connected to each other to serve as an anode. The porous sintered body |
| 7450366 |
Solid electrolytic capacitor |
November 11, 2008 |
| A solid electrolytic capacitor (A1) includes a porous sintered body (1) of valve metal, internal anode terminals (11a, 11b) projecting from the porous sintered body, and external anode terminals (21a, 21b) positioned lower than the internal anode terminals and having a bottom surface |
| 7385804 |
Solid electrolytic capacitor, electric circuit, and solid electrolytic capacitor mounting struct |
June 10, 2008 |
| A solid electrolytic capacitor (A1) includes a porous sintered body (10) of metal particles or conductive ceramic particles, anode wires (11A, 11B) partially inserted in the porous sintered body (10), an anode terminal provided by portions of the anode wires (11A, 11B) which project |
| 7359181 |
Solid electrolytic capacitor |
April 15, 2008 |
| A solid electrolytic capacitor includes a porous sintered body made of valve metal, and an external anode terminal used for surface-mounting. The anode terminal is offset from the center of the sintered body, as viewed in the thickness direction or first direction of the sintered bod |
| 7154741 |
Niobium capacitor and method for manufacturing same |
December 26, 2006 |
| A niobium capacitor having an anode (1) with niobium as its maim component, and a dielectric layer (4) formed on the anode. The anode (1) and the dielectric layer (4) are in close contact with each other with an interface therebetween. A junction region is defined as the region inclu |
| 7138000 |
Solid electrolytic capacitor and method of making the same |
November 21, 2006 |
| A method is provided for making a solid electrolytic capacitor comprising a flattened porous body. According to this method, use is made of a pair of pressure blocks and a vertical movement block for engagement with the pair of pressure blocks. The pair of pressure blocks face each other |
| 7056357 |
Method for making solid electrolytic capacitor |
June 6, 2006 |
| A method for making a solid electrolytic capacitor including a flat porous body is provided. This method utilizes a mold which includes a horizontal surface and four vertical side surfaces. The horizontal surface and the side surfaces define a cavity into which powder made of valve metal |
| 7031141 |
Solid electrolytic capacitor and electric circuit |
April 18, 2006 |
| A solid electrolytic capacitor includes a cathode including a solid electrolytic layer, an anode, and a dielectric layer provided between the cathode and the anode. The anode includes an anode body, an input anode terminal and an output anode terminal. A bypass current path for causing |
| 6819546 |
Packaged solid electrolytic capacitor and method of making the same |
November 16, 2004 |
| A solid electrolytic capacitor is provided which includes a capacitor element having an anode and a cathode, a sheet member for mounting the capacitor element, and a protection package formed on the sheet member to enclose the capacitor element. The sheet member is provided with an anode |
| 6346127 |
Method of packaging solid electrolytic capacitor having terminatons formed on cut surfaces of a |
February 12, 2002 |
| A solid electrolytic capacitor is provided which includes a capacitor element having an anode and a cathode, a sheet member for mounting the capacitor element, and a protection package formed on the sheet member to enclose the capacitor element. The sheet member is provided with an anode |
| 6259348 |
Surface mounting type electronic component incorporating safety fuse |
July 10, 2001 |
| A surface mounting type electronic component such as a solid electrolytic capacitor is provided which comprises an electronic element, a safety fuse wire having a base end electrically connected to the electronic element, and a resin package enclosing the electronic element together with |
| 6214060 |
Process of making a capacitor element for a solid electrolytic capacitor |
April 10, 2001 |
| A process for making a capacitor element for a solid electrolytic capacitor is provided. The process includes the steps of compacting valve metal powder into a porous chip so that an anode wire projects from the porous chip via an end surface, fixing an anode plate to the anode wire, app |
| 6040229 |
Method for manufacturing a solid electrolytic capacitor array |
March 21, 2000 |
| A solid electrolytic capacitor array includes a substrate (12) made of conductive silicon, and an insulation film (15) which is formed with a plurality of contact holes is formed on an upper surface of the substrate. A plurality of contact layers (18) which are respectively connected to |
| 5959831 |
Capacitor element for solid electrolytic capacitor |
September 28, 1999 |
| A capacitor element for a solid electrolytic capacitor includes a capacitor chip which is a compacted mass of valve metal powder, and an anode wire projecting from an end face of the capacitor chip. The capacitor chip includes a chamfer portion located adjacent to and surrounding the end |
| 5949639 |
Capacitor element for solid electrolytic capacitor, device and process for making the same |
September 7, 1999 |
| A capacitor element for a solid electrolytic capacitor includes a capacitor chip which is a compacted mass of valve metal powder, and an anode wire projecting from a first end face of the capacitor chip. The capacitor chip includes at least one side face which is formed with at least one |
| 5699597 |
Method of manufacturing a tantalum solid state electrolytic capacitor |
December 23, 1997 |
| The use of a wire of a metal other than tantalum as a lead wire fixed to a chip formed by sintering tantalum powder is enabled. Prior to the formation of a dielectric film on a chip through anodic oxidation, an insulating material is applied to a surface of the lead wire fixed to the |
| 5693104 |
Process for making capacitor element for solid electrolytic capacitor |
December 2, 1997 |
| A process of making a capacitor element for a solid electrolytic capacitor is provided which comprises the steps of preparing at least one capacitor piece which includes a chip of a sintered mass of metal powder and an anode wire projecting from the chip, forming a dielectric layer on th |
| 5682057 |
Semiconductor device incorporating a temperature fuse |
October 28, 1997 |
| A semiconductor device is provided which comprises a semiconductor chip including at least one semiconductor element and at least two surface electrodes, at least two lead terminals one of which is electrically connected to a first one of the surface electrodes, a temperature fuse el |
| 5644281 |
Electronic component incorporating solder fuse wire |
July 1, 1997 |
| An electronic component is provided which includes at least one chip element having at least two poles; and at least two leads respectively connected electrically to the two poles. At least one of the two leads is electrically connected to a corresponding one of the two poles through a |
| 5559668 |
Package-type solid electrolytic capacitor |
September 24, 1996 |
| A package-type solid electrolytic capacitor is provided which comprises: a capacitor chip having a first end and a second end opposite to the first end, the chip being formed with a cathode terminal coating at least covering the second end; an anode wire partially projecting from the fir |
| 5538176 |
Method of forming a ball end for a solder wire |
July 23, 1996 |
| A method is provided for forming a ball at a lower end of a material solder wire which is arranged generally vertically. The method comprises the steps of: forming an upward stream of an oxygen-free gas surrounding the solder wire; bringing a lateral flame of combustion to a ball forming |
| 5504647 |
Solid electrolytic capacitor having a fuse wire partially enclosed in an elastic resin |
April 2, 1996 |
| A solid electrolytic capacitor that includes a capacitor element including a chip and an anode wire projecting from a first end face of the chip. The chip has a second end face opposite to the first end face and a side face between the first and second end faces. An anode lead is electri |
| 5502614 |
Solid electrolytic capacitor |
March 26, 1996 |
| A solid electrolytic capacitor comprises a capacitor element including a chip body and an anode wire projecting from the chip body, an anode lead electrically connected to the anode wire, a cathode lead paired with the anode lead, a first fuse wire connecting electrically between the chi |
| 5461539 |
Heat sensitive electronic component |
October 24, 1995 |
| An electronic component is provided which comprises a resin package for enclosing inside parts. The package has a heat sensitive surface portion provided with a heat sensitive material which irreversibly discolors at a temperature higher than the soldering temperature for the electronic |
| 5461538 |
Capacitor element for solid electrolytic capacitor |
October 24, 1995 |
| A capacitor element for a solid electrolytic capacitor is provided which comprises a sintered chip of metal powder, the chip having a first end and a second end opposite to the first end. The chip includes a tapered body whose cross-sectional area reduces from the first end to the second |
| 5459641 |
Polar electronic component and mounting structure therefor |
October 17, 1995 |
| A polar electronic component is provided which comprises a polar element, a first lead electrically connected to a first pole of the polar element, a second lead electrically connected to a second pole of the polar element, and an insulating package enclosing the polar element together w |
| 5432672 |
Solid electrolytic capacitor |
July 11, 1995 |
| A solid electrolytic capacitor of the type having a built-in fuse is disclosed in which a connecting portion between the fuse and a capacitor element is made thin and securely formed to accommodate the capacitor element to be increased in capacitance without changing the outer size of |
| 5431329 |
Method of forming a ball end for a solder wire |
July 11, 1995 |
| A method is provided for forming a ball at a lower end of a material solder wire which is arranged generally vertically. The method comprises the steps of: forming an upward stream of an oxygen-free gas surrounding the solder wire; bringing a lateral flame of combustion to a ball forming |
| 5424909 |
Package-type solid electrolytic capacitor |
June 13, 1995 |
| A package-type solid electrolytic capacitor is provided which comprises a capacitor element including a chip from which an anode wire partially projects out, a resin package enclosing the capacitor element, and a diode also enclosed in the package. The diode has a negative pole electrica |
| 5329421 |
Solid electrolytic capacitor |
July 12, 1994 |
| A solid electrolytic capacitor comprises a capacitor element including a chip body and an anode wire projecting from the chip body, an anode lead electrically connected to the anode wire, a cathode lead paired with the anode lead, a first fuse wire connecting electrically between the chi |
| 5315474 |
Solid electrolytic capacitor |
May 24, 1994 |
| A solid electrolytic capacitor comprises a capacitor element including a chip body and an anode wire projecting from the chip body, an anode lead electrically connected to the anode wire, a cathode lead paired with the anode lead, a fuse wire having a first end electrically connected to |
| 5075940 |
Process for producing solid electrolytic capacitors |
December 31, 1991 |
| The present invention provides a process which is particularly suited for mass-producing solid electrolytic capacitors. The process utilizes a combination of a mold and a presser member. The mold has a series of molding recesses, and a lead receiving groove extending along and through |
