| Patent Number |
Title Of Patent |
Date Issued |
| 7553512 |
Method for fabricating an inorganic resistor |
June 30, 2009 |
| Precursor compositions for the fabrication of electronic features such as resistors and capacitors. The precursor compositions are formulated to have a low conversion temperature, such as not greater than about 350.degree. C., thereby enabling the fabrication of such electronic featu |
| 7524528 |
Precursor compositions and methods for the deposition of passive electrical components on a subs |
April 28, 2009 |
| Precursor compositions for the deposition of electronic features such as resistors and dielectric components and methods for the deposition of the precursor compositions. The precursor compositions have a low viscosity, such as not greater than about 1000 centipoise and can be deposited |
| 7507687 |
Electrocatalyst powders, methods for producing powder and devices fabricated from same |
March 24, 2009 |
| Electrocatalyst powders and methods for producing electrocatalyst powders, such as carbon composite electrocatalyst powders. The powders have a well-controlled microstructure and morphology. The method includes forming the particles from an aerosol of precursors by heating the aeroso |
| 7498015 |
Method of making silane compositions |
March 3, 2009 |
| A method of making hydrogenated Group IVA compounds having reduced metal-based impurities, compositions and inks including such Group IVA compounds, and methods for forming a semiconductor thin film. Thin semiconducting films prepared according to the present invention generally exhi |
| 7422708 |
Compositions for forming a semiconducting and/or silicon-containing film, and structures formed |
September 9, 2008 |
| Compositions, inks and methods for forming a patterned silicon-containing film and patterned structures including such a film. The composition generally includes (a) passivated semiconductor nanoparticles and (b) first and second cyclic Group IVA compounds in which the cyclic species |
| 7315068 |
Interface layer for the fabrication of electronic devices |
January 1, 2008 |
| The present invention is directed to methods for making electronic devices with a thin anisotropic conducting layer interface layer formed between a substrate and an active device layer that is preferably patterned conductive layer. The interface layer preferably provides Ohmic and/or |
| 7259101 |
Nanoparticles and method for making the same |
August 21, 2007 |
| A method for making nanoparticles, nanoparticle inks and device layers therefrom is disclosed. In accordance with the present invention, nanoparticles are isolated from a composite material that is formed by treating a metal oxide precursor to form the metal nanoparticles and a metal |
| 7259100 |
Nanoparticles and method for making the same |
August 21, 2007 |
| A method for making nanoparticles, nanoparticle inks and device layers therefrom is disclosed. In accordance with the present invention, nanoparticles are isolated from a composite material that is formed by treating a metal oxide precursor to form the metal nanoparticles and a metal |
| 7078276 |
Nanoparticles and method for making the same |
July 18, 2006 |
| A method for making nanoparticles, nanoparticle inks and device layers therefrom is disclosed. In accordance with the present invention, nanoparticles are isolated from a composite material that is formed by treating a metal oxide precursor to form the metal nanoparticles and a metal |
| 6957608 |
Contact print methods |
October 25, 2005 |
| A method of and device for controlled printing using liquid embossing techniques is disclosed. In accordance with the embodiments of the invention a stamp comprises a differentiated embossing surface with protruding and recessed surfaces to enhance the ability of the stamp to selecti |
| 6951666 |
Precursor compositions for the deposition of electrically conductive features |
October 4, 2005 |
| A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a viscosity of at least about 1000 centipoise and can be deposited by screen printing. The precursor composition also has a low |
| 6911385 |
Interface layer for the fabrication of electronic devices |
June 28, 2005 |
| The present invention is directed to methods for making electronic devices with a thin anisotropic conducting layer interface layer formed between a substrate and an active device layer that is preferably patterned conductive layer. The interface layer preferably provides Ohmic and/or |
