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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Kumar; Nalin
Address:
Austin, TX
No. of patents:
46
Patents:












Patent Number Title Of Patent Date Issued
6629869 Method of making flat panel displays having diamond thin film cathode October 7, 2003
A field emission cathode is provided which includes a substrate and a conductive layer desposed adjacent the substrate. An electrically resistive pillar is disposed adjacent the conductive layer, the resistive pillar having a substantially flat surface spaced from and substantially p
6552563 Display panel test device April 22, 2003
A device for testing flat panel displays includes an interface having compliant bumps mounted thereon, which make electrical contact with pads on the display panel. The interface may have a hole formed therein for allowing the passage of light therethrough when the interface is mounted
6417686 Display panel test device July 9, 2002
A device for testing flat panel displays includes an interface having compliant bumps mounted thereon, which make electrical contact with pads on the display panel. The interface may have a hole formed therein for allowing the passage of light therethrough when the interface is mounted
6127773 Amorphic diamond film flat field emission cathode October 3, 2000
A field emission cathode for use in flat panel displays is disclosed comprising a layer of conductive material and a layer of amorphic diamond film, functioning as a low effective work-function material, deposited over the conductive material to form emission sites. The emission sites
6111354 Field emission lamp structures August 29, 2000
A field emission lamp, of either a diode or triode structure has a packaging whereby electrical access to the various electrodes of the lamp is provided through the rear or underside of the field emission device so that the individual lamps can be placed in close proximity to each other.
6084338 Cathode assembly with diamond particles and layer July 4, 2000
A cathode assembly includes a substrate (1101), a plurality of electrically conductive strips (1102), nano-size diamond particles (1701), and a layer (1801) of diamond material deposited (CVD) over the diamond particles (1701).
6008595 Field emission lamp structures December 28, 1999
A field emission lamp, of either a diode or triode structure has a packaging whereby electrical access to the various electrodes of the lamp is provided through the rear or underside of the field emission device so that the individual lamps can be placed in close proximity to each other.
5973452 Display October 26, 1999
The present invention provides for a field emission device including an anode assembly and a cathode assembly, wherein the cathode assembly further includes a substrate, a plurality of electrically conducting strips deposited on the substrate, and a continuous layer of diamond materi
5947783 Method of forming a cathode assembly comprising a diamond layer September 7, 1999
A cathode assembly includes a substrate, a plurality of electrically conducting strips deposited on the substrate, and a continuous layer of diamond material deposited over the plurality of electrically conducting strips and portions of the substrate exposed between the plurality of
5926239 Backlights for color liquid crystal displays July 20, 1999
A backlight for a color liquid crystal display uses various techniques for activating colored phosphors, which emit colored light to each one of several sub-pixels within a particular liquid crystal display pixel. Activation of the colored phosphors may be performed using field emission
5703435 Diamond film flat field emission cathode December 30, 1997
A field emission cathode for use in flat panel displays is disclosed comprising a layer of conductive material and a layer of amorphic diamond film, functioning as a low effective work-function material, deposited over the conductive material to form emission sites. The emission sites
5686791 Amorphic diamond film flat field emission cathode November 11, 1997
A field emission cathode for use in flat panel displays is disclosed comprising a layer of conductive material and a layer of amorphic diamond film, functioning as a low effective work-function material, deposited over the conductive material to form emission sites. The emission sites
5675216 Amorphic diamond film flat field emission cathode October 7, 1997
A field emission cathode for use in flat panel displays is disclosed comprising a layer of conductive material and a layer of amorphic diamond film, functioning as a low effective work-function material, deposited over the conductive material to form emission sites. The emission sites
5659224 Cold cathode display device August 19, 1997
A display device for use in conjunction with a computer system includes a cathode having a layer of conductive material and a layer of low-effective work function material deposited over the conductive material wherein the low-effective work function material has an emission surface comp
5652083 Methods for fabricating flat panel display systems and components July 29, 1997
A method is provided for fabricating a display cathode which includes forming a conductive line adjacent a face of a substrate. A region of amorphic diamond is formed adjacent a selected portion of the conductive line.
5614353 Methods for fabricating flat panel display systems and components March 25, 1997
A method is provided for fabricating a display cathode which includes forming a conductive line adjacent a face of a substrate. A region of amorphic diamond is formed adjacent a selected portion of the conductive line.
5612712 Diode structure flat panel display March 18, 1997
A matrix-addressed diode flat panel display of field emission type is described, utilizing a diode (two terminal) pixel structure. The flat panel display comprises a cathode assembly having a plurality of cathodes, each cathode including a layer of cathode conductive material and a layer
5601966 Methods for fabricating flat panel display systems and components February 11, 1997
A method is provided for fabricating a display cathode which includes forming a conductive line adjacent a face of a substrate. A region of amorphic diamond is formed adjacent a selected portion of the conductive line.
5600200 Wire-mesh cathode February 4, 1997
A field emission cathode for use in flat panel displays comprises a layer of conductive material and a layer of amorphic diamond film, functioning as a low effective work-function material, deposited over the conductive material to form emission sites. The emission sites each contain at
5551903 Flat panel display based on diamond thin films September 3, 1996
A field emission cathode is provided which includes a substrate and a conductive layer disposed adjacent the substrate. An electrically resistive pillar is disposed adjacent the conductive layer, the resistive pillar having a substantially flat surface spaced from and substantially p
5548185 Triode structure flat panel display employing flat field emission cathode August 20, 1996
A flat panel display of a field emission type having a triode (three terminal) structure and useful as a device for displaying visual information is disclosed. The display includes a plurality of corresponding light-emitting anodes and field-emission cathodes, each of the anodes emit
5543684 Flat panel display based on diamond thin films August 6, 1996
A field emission cathode is provided which includes a substrate and a conductive layer disposed adjacent the substrate. An electrically resistive pillar is disposed adjacent the conductive layer, the resistive pillar having a substantially flat surface spaced from and substantially p
5536193 Method of making wide band gap field emitter July 16, 1996
A field emitter comprising an exposed wide band gap emission area in contact with and protruding from a planar surface of a conductive metal, and a method of making is disclosed. Suitable wide band gap materials (2.5-7.0 electron-volts) include diamond, aluminum-nitride and gallium-n
5528099 Lateral field emitter device June 18, 1996
Lateral luminescent field emitter devices for use in flat panel displays and a method of manufacturing are described. The device comprises a flat substrate, an anode disposed on the substrate, and a cathode disposed on the substrate, the cathode providing an electron emission surface cap
5451551 Multilevel metallization process using polishing September 19, 1995
A maskless process for forming a protected metal feature in a planar insulating layer of a substrate is disclosed. A first barrier material is disposed in a recess in an insulating layer, a conductive metal is disposed on the first barrier material such that the entire metal feature
5449970 Diode structure flat panel display September 12, 1995
A matrix-addressed diode flat panel display of field emission type is described, utilizing a diode (two terminal) pixel structure. The flat panel display includes a cathode assembly having a plurality of cathodes, each cathode including a layer of cathode conductive material and a layer
5445550 Lateral field emitter device and method of manufacturing same August 29, 1995
Lateral luminescent field emitter devices for use in flat panel displays and a method of manufacturing are described. The device comprises a flat substrate, an anode disposed on the substrate, and a cathode disposed on the substrate, the cathode providing an electron emission surface cap
5399238 Method of making field emission tips using physical vapor deposition of random nuclei as etch ma March 21, 1995
A method of making sub-micron low work function field emission tips without using photolithography. The method includes physical vapor deposition of randomly located discrete nuclei to form a discontinuous etch mask. In one embodiment an etch is applied to low work function material cove
5382315 Method of forming etch mask using particle beam deposition January 17, 1995
A method of forming an etch mask and patterning a substrate. The method includes directing a particle beam at a substrate without using a mask to deposit an etch mask on the substrate which selectively exposes predetermined portions of the substrate, the etch mask consisting of parti
5380546 Multilevel metallization process for electronic components January 10, 1995
A maskless process for forming a protected metal feature in a planar insulating layer of a substrate is disclosed. A first barrier material is disposed in a recess in an insulating layer, a conductive metal is disposed on the first barrier material such that the entire metal feature
5341063 Field emitter with diamond emission tips August 23, 1994
A field emitter comprising a conductive metal and a diamond emission tip with negative electron affinity in ohmic contact with and protruding above the metal. The field emitter is fabricated by coating a substrate with an insulating diamond film having negative electron affinity and a to
5331172 Ionized metal cluster beam systems and methods July 19, 1994
Ionized metal cluster beam deposition of metal bumps on substrates such as multi-chip modules and integrated circuit chips is enhanced. The present invention discloses wet etching techniques for removing unwanted metal deposited on the substrate around bumps, multiple sources for deposit
5317006 Cylindrical magnetron sputtering system May 31, 1994
An improved cathode for a sputtering system includes a metal cylinder and strips of material bonded to the inside of the metal cylinder and/or material sprayed onto the inside of the metal cylinder. The strips may have various specified compositions and/or configurations and/or other
5312514 Method of making a field emitter device using randomly located nuclei as an etch mask May 17, 1994
Method of making a field emitter device with submicron low work function emission tips without using photolithography. The method includes depositing in situ by evaporating or sputtering a discontinuous etch mask comprising randomly located discrete nuclei. In one embodiment an ion etch
5290732 Process for making semiconductor electrode bumps by metal cluster ion deposition and etching March 1, 1994
Ionized metal cluster beam deposition of metal bumps on substrates such as multi-chip modules and integrated circuit chips is enhanced. The present invention discloses wet etching techniques for removing unwanted metal deposited on the substrate around bumps, and multiple sources for
5254493 Method of fabricating integrated resistors in high density substrates October 19, 1993
A process for fabricating integrated resistors in high density interconnect substrates for multi-chip modules. In addition, the resistor material can be converted selectively into an insulator for optionally allowing for the simultaneous fabrication of integrated resistors and capacitors
5244538 Method of patterning metal on a substrate using direct-write deposition of a mask September 14, 1993
A method of patterning metal on a substrate without photolithography. The steps include providing a dielectric substrate, forming a metal mask in a predetermined pattern on the substrate without using a mask by direct-write deposition using a particle beam such as a liquid metal clus
5229358 Method and apparatus for fabricating superconducting wire July 20, 1993
A superconducting wire which includes a base wire and at least a superconduction layer formed on the base wire. The superconduction layer may be formed by using a sputtering system for depositing a film of high temperature superconductor material on the base wire. The superconducting
5227013 Forming via holes in a multilevel substrate in a single step July 13, 1993
A method for forming via holes in a multilayer structure in a single step. The invention includes disposing over a base a first layer comprising first metal lines beneath a first dielectric, disposing over the first layer a second layer comprising second metal lines beneath a second
5199918 Method of forming field emitter device with diamond emission tips April 6, 1993
A field emitter device comprising a conductive metal and a diamond emission tip with negative electron affinity in ohmic contact with and protruding above the metal. The device is fabricated by coating a substrate with an insulating diamond film having negative electron affinity and a to
5196102 Method and apparatus for applying a compound of a metal and a gas onto a surface March 23, 1993
A method of applying a compound of a metal and a reactive gas onto a surface by depositing a metal from a liquid metal cluster ion source onto said surface in the presence of a gas on the surface to combine with the deposited metal while isolating the gas from the source of the metal
5178743 Cylindrical magnetron sputtering system January 12, 1993
A system for depositing a film on a substrate includes a sputtering system and means for causing the substrate to move through the sputtering system. Embodiments of the present invention employ a cylindrical hollow cathode magnetron sputtering system, which causes the overall film deposi
5164332 Diffusion barrier for copper features November 17, 1992
A diffusion barrier which reduces the diffusion of a copper feature into an oxygen containing polymer is provided by a copper metal alloy. The diffusion barrier is fabricated by coating a metal on a copper feature, heating the metal and copper feature to form an alloy of the copper f
5156997 Method of making semiconductor bonding bumps using metal cluster ion deposition October 20, 1992
A method of making bonding bumps on the pads of an electrical chip including depositing a layer of metallic adhesion material over the surface, depositing metallic bumps on the metallic adhesion material over each of the pad areas using a focused liquid metal ion source, and chemical
5120572 Method of fabricating electrical components in high density substrates June 9, 1992
A process for fabricating integrated resistors in high density interconnect substrates for multi-chip modules. In addition, the resistor material can be connected selectively into an insulator for optionally allowing for the simultaneous fabrication of integrated resistors and capacitors
5118385 Multilayer electrical interconnect fabrication with few process steps June 2, 1992
Method for making a multilayer electrical interconnect with stacked pillars between layers using a minimal number of conventional process steps. The method includes sputtering a chromium/copper/titanium trilayer on a dielectric base, depositing a patterned mask on the trilayer, etching t










 
 
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