| Patent Number |
Title Of Patent |
Date Issued |
| 8268251 |
Early warning sulfur detection based on change in fluorescence intensity of polymer-bound phosph |
September 18, 2012 |
| An early warning sulfur detection system for detecting the presence of corrosive gases, especially elemental sulfur (S.sub.8), in air employs a substrate that includes a polymer-bound phosphine compound having sulfur-getting functionality. The phosphine compound in the polymer reacts |
| 8251749 |
Implementing impedance gradient connector for board-to-board applications |
August 28, 2012 |
| A method and connector housing are provided for implementing an impedance gradient connector for board-to-board applications. The impedance gradient connector housing includes a plurality of impedance zones with a first impedance zone including a first mating face with a first Printed |
| 8230592 |
Method for via stub elimination |
July 31, 2012 |
| An enhanced mechanism is disclosed for via stub elimination in printed wiring boards (PWBs) and other substrates. In one embodiment, the substrate includes a plurality of insulator layers and internal conductive traces. First and second through-holes extend completely through the sub |
| 8136240 |
Method of forming a substrate having a plurality of insulator layers |
March 20, 2012 |
| A mechanism is disclosed for providing horizontally split vias in printed wiring boards (PWBs) and other substrates. In one embodiment, the substrate includes a plurality of insulator layers and internal conductive traces. First and second through-holes extend completely through the |
| 8007291 |
Implementing differential signal circuit board electrical contact |
August 30, 2011 |
| A method, and structures are provided for implementing differential signal circuit board electrical contact. A removable member including a pair of independent electrical contacts is removably received within an associated contact-receiving cavity on the circuit board. The contact-re |
| 7968987 |
Carbon dioxide gettering for a chip module assembly |
June 28, 2011 |
| A chip module assembly includes a CO.sub.2 getter exposed through a gas-permeable membrane to a chip cavity of a chip module. One or more chips is/are enclosed within the cavity. The CO.sub.2 getter comprises a liquid composition including 1,8-diaza-bicyclo-[5,4,0]-undec-7-ene (DBU) |
| 7832096 |
Method for producing an organic substrate with integral thermal dissipation channels |
November 16, 2010 |
| A chip module heat transfer apparatus includes one or more chips electronically connected to a module substrate by controlled collapse chip connection (C4) solder joints. The module substrate, which is preferably an FR-4 laminate or other organic substrate, has cut-out channels forme |
| 7760502 |
Cooling system employing a heat exchanger with phase change material, and method of operation th |
July 20, 2010 |
| A heat exchanger for use, e.g., in a rear door of a server rack in a computer room, made up of pipes clad with a layer of a phase change material, such as a paraffin, so that latent heat is absorbed in the conversion from the solid to the liquid state. Preferably, each pipe in turn i |
| 7632127 |
Socket and method for compensating for differing coefficients of thermal expansion |
December 15, 2009 |
| The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated ho |
| 7530853 |
Socket and method for compensating for differing coefficients of thermal expansion |
May 12, 2009 |
| The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an el |
| 7512299 |
Fiber optic cable systems and methods incorporating a luminescent compound-containing layer to i |
March 31, 2009 |
| Fiber optic cable systems and methods incorporating a luminescent compound-containing layer to identify cracks. Exemplary embodiments include a fiber optic cable apparatus including a core for receiving laser light emitted from a VCSEL for the detection of faults in the fiber optic c |
| 7497713 |
Automatically adjustable connector to accommodate circuit board of varying thickness |
March 3, 2009 |
| A card edge connector assembly with a housing with side walls and a housing base portion embodying an unique card edge auto thickness detection mechanism that includes a pair of movable block members with interconnected upstanding auto thickness detection members and contact pins, a |
| 7489596 |
Methods and apparatus capable of indicating elapsed time intervals |
February 10, 2009 |
| A method and apparatus of defining a time interval includes providing a source of ionizing radiation that radiates emissions thereof; placing a radiation sensitive display material responsive to ionizing radiation in a close proximity relationship to the source of ionizing radiation |
| 7479590 |
Dry adhesives, methods of manufacture thereof and articles comprising the same |
January 20, 2009 |
| Disclosed herein is a printed circuit board comprising a laminate that comprises a copper foil; inorganic or metallic nanoparticles having an average diameter of less than 100 nanometers disposed on a surface of the copper foil; the nanoparticles being arranged in domains; the domains |
| 7472477 |
Method for manufacturing a socket that compensates for differing coefficients of thermal expansi |
January 6, 2009 |
| The illustrative embodiments provide a method for manufacturing a socket and attaching the socket to a printed circuit board. Surface mounted contacts for a bottom surface of a socket are provided. The surface mounted contacts are a plurality of conductive metal pads that directly at |
| 7462506 |
Carbon dioxide gettering method for a chip module assembly |
December 9, 2008 |
| A chip module assembly includes a CO.sub.2 getter exposed through a gas-permeable membrane to a chip cavity of a chip module. One or more chips is/are enclosed within the cavity. The CO.sub.2 getter comprises a liquid composition including 1,8-diaza-bicyclo-[5,4,0]-undec-7-ene (DBU) |
| 7382620 |
Method and apparatus for optimizing heat transfer with electronic components |
June 3, 2008 |
| A heat transfer assembly includes a printed circuit board assembly supporting an electronic component assembly including one or more semiconductor chips. A heat sink assembly is adapted to be placed in thermal engagement with the one or more semiconductor chips. Included is a loading |
| 7356228 |
Fiber optic cable systems and methods incorporating a luminescent compound-containing layer to i |
April 8, 2008 |
| Fiber optic cable systems and methods incorporating a luminescent compound-containing layer to identify cracks. Exemplary embodiments include a fiber optic cable apparatus including a core for receiving laser light emitted from a VCSEL for the detection of faults in the fiber optic c |
| 7317514 |
System and method for optimizing heat management |
January 8, 2008 |
| Disclosed are heat management method, and system, and computer program product that include at least one optical strain gauge that is mounted on a printed board in proximity to an object being monitored for temperature changes. Power for controlling heat to the object is modified in resp |
| 7303443 |
Socket and method for compensating for differing coefficients of thermal expansion |
December 4, 2007 |
| The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an el |
| 7298623 |
Organic substrate with integral thermal dissipation channels, and method for producing same |
November 20, 2007 |
| A chip module heat transfer apparatus includes one or more chips electronically connected to a module substrate by controlled collapse chip connection (C4) solder joints. The module substrate, which is preferably an FR-4 laminate or other organic substrate, has cut-out channels forme |
| 7288161 |
Reworkable adhesives containing thermally labile groups |
October 30, 2007 |
| Embodiments of the present invention relate to adhesive compositions containing thermally-labile groups for decreasing the degradation temperature of the adhesive for reworkability of electronic components in surface mounting applications. In one embodiment, the thermally reworkable |
| 7062143 |
Modular mechanism for protecting fiber optic cables |
June 13, 2006 |
| A method and modular mechanism are provided for protecting fiber optic cables. The modular mechanism includes an inner member for receiving the fiber optic cable, and an outer container receiving and retaining the inner member, such as, an inner tube and outer tube. The inner member and |
| 6991473 |
Electrical connector with elastomeric pad having compressor fingers each including a filler memb |
January 31, 2006 |
| An electrical connector includes connector pads on a printed circuit board and contact members on an insulating substrate. The contact members are pressed against the contact pads by a compression mat having compressor fingers. A clamping arrangement forces the compressor fingers against |
| 6981879 |
Land grid array (LGA) interposer with adhesive-retained contacts and method of manufacture |
January 3, 2006 |
| A novel Land Grid Array (LGA) interposer with adhesive-retained contacts and method of manufacture provide improved reliability in LGA mounting applications. A flexible adhesive is used to secure LGA interposer contacts to the walls of voids through an interposer frame. The contacts |
| 6939144 |
Electrical connector with elastomeric element and restrainer member to offset relaxation of the |
September 6, 2005 |
| An electrical connector includes contact pads on a printed circuit board and contact members on a substrate. The contact members are pressed against the contact pads by a compression mat having compressor fingers. A clamping arrangement forces the compressor fingers against the substrate |
| 6814589 |
Electrical connector with elastomeric element and restrainer member to offset relaxation of the |
November 9, 2004 |
| An electrical connector includes contact pads on a printed circuit board and contact members on a substrate. The contact members are pressed against the contact pads by a compression mat having compressor fingers. A clamping arrangement forces the compressor fingers against the substrate |
| 6676301 |
Enhanced optical coupler |
January 13, 2004 |
| An optical coupler includes a first plate and a second plate superposed over the first plate. At least the second plate has at least one groove formed therein. The at least one groove extends continuously from one edge of the second plate to another edge of the second plate. An optical f |
| 6652159 |
Enhanced optical transceiver arrangement |
November 25, 2003 |
| An optical transceiver arrangement includes a retainer assembly. The retainer assembly includes at least one housing adapted to be coupled to a fiber optic cable, and at least one carrier assembly having a carrier, and a die chip attached to the carrier. The die chip has at least one act |
