| Patent Number |
Title Of Patent |
Date Issued |
| 7612295 |
Printed wiring board and method for manufacturing the same |
November 3, 2009 |
| In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon another. The first conductive layer (11) is constituted as a parts connecting layer and the n-th conductive layer (13) is constituted as an external |
| 7594320 |
Method of manufacturing printed wiring board |
September 29, 2009 |
| A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the |
| 7552531 |
Method of manufacturing a printed wiring board having a previously formed opening hole in an inn |
June 30, 2009 |
| A method of producing a printed wiring board comprising innerlayer conductor circuits among insulating layers and blind via-holes formed by irradiating laser beams from the outermost surface of the insulating layer toward the innerlayer conductor circuit. A central portion of the inn |
| 7339118 |
Printed wiring board and method for manufacturing the same |
March 4, 2008 |
| In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon each other. The first conductive layer (11) is a parts connecting layer and the n-th conductive layer (13) is an external connecting layer which is conne |
| 6986917 |
Printed wiring board and method of manufacturing the same |
January 17, 2006 |
| A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the |
| 6809415 |
Printed-circuit board and method of manufacture thereof |
October 26, 2004 |
| A printed circuit board 1 providing superior adhesion between a substrate 2 and a conductor pattern 3 and preventing damage of the substrate 2. The width c of the bottom surface 310 of the conductor pattern 3 is greater than the width d of the top surface 320. Accordingly, the conductor |
| 6590165 |
Printed wiring board having throughole and annular lands |
July 8, 2003 |
| In the production of a printed wiring board comprising innerlayer conductor circuits 161, 131 arranged among insulating layers 101.about.103 and blind via-holes 141, 142 formed from an outermost surface of the insulating layer toward the innerlayer conductor circuit, an opening hole 160 |
| 6555208 |
Printed wiring board and method of manufacturing the same |
April 29, 2003 |
| A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the port |
| 6455783 |
Multilayer printed wiring board and method for manufacturing the same |
September 24, 2002 |
| A method for manufacturing a multilayer printed circuit board that shortens the distance between pattern layers and facilitates formation of a minute conductive hole having superior conductive reliability. A core substrate (21) including ad core pattern (12, 13), which has a pad (101, 11 |
| 6284353 |
Printed wiring board and method of manufacturing the same |
September 4, 2001 |
| A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the port |
| 6228466 |
Printed wiring board and method for manufacturing the same |
May 8, 2001 |
| A printed wiring board which has a conductor circuit (12) on an insulating substrate (10) and a surface insulating layer (14) formed on the surface of the substrate (10) including the surface of the conductor circuit (12). Part of the conductor circuit (12) has an exposed conductor secti |
| 5530204 |
Electronic-parts mounting board and electronic-parts mounting board frame |
June 25, 1996 |
| An electronic-parts mounting board frame is formed by assembling a plurality of electronic-parts mounting boards into a single frame. The mounting boards may be electrically connected to the frame by separate inner and outer lead frames, the former being formed in the mounting boards |
| 5274197 |
Electronic-parts mounting board and electronic-parts mounting board frame |
December 28, 1993 |
| An electronic-parts mounting board frame is formed by assembling a plurality of electronic-parts mounting boards into a single frame. The mounting boards may be electrically connected to the frame by separate inner and outer lead frames, the former being formed in the mounting boards |
