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Inventor: Koiwa; Kaoru
Address: Kawasaki, JP
No. of patents: 5
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 5909058 |
Semiconductor package and semiconductor mounting part |
June 1, 1999 |
| A thin type semiconductor package having a low thermal resistance and a low electric resistance is disclosed, that comprises a nitride ceramic supporting substrate having a first main surface and a second main surface, the nitride ceramic supporting substrate having via-holes that pa |
| 5907187 |
Electronic component and electronic component connecting structure |
May 25, 1999 |
| In such electronic components as semiconductor packages and semiconductor chips which are possessed of groups of connecting bumps as input and output terminals, the groups of connecting bumps comprise not less than two kinds of connecting bumps different in melting point or not less than |
| 5622769 |
Ceramic circuit board having a thermal conductivity substrate |
April 22, 1997 |
| According to this invention, there is disclosed a thermal conductivity substrate which includes an aluminum nitride sintered body and a coating layer formed on the body of aluminum phosphate and having a surface roughness of 1 .mu.m or less, and which has excellent humidity resistance |
| 5412160 |
Circuit board |
May 2, 1995 |
| A circuit board comprising a substrate, at least one dielectric film formed on the substrate and made of at least one selected from the group consisting of AlN, BN, diamond, diamond-like carbon, BeO and SiC, the dielectric film having pores of a porosity of 5 to 95% by volume, and at |
| 5326623 |
Circuit board |
July 5, 1994 |
| A circuit board including a circuit pattern adhered firmly to a ceramic substrate and capable of eliminating an increase in resistivity due to an influence of an external environment, particularly, a thermal influence is disclosed. The circuit board comprises a ceramic substrate, and a c |
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