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Inventor:
Kobayashi; Yoshikazu
Address:
Ota-ku, JP
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
7677955 Grinding method for wafer March 16, 2010
A grinding method for a wafer having a plurality of devices on the front side, wherein the back side of the wafer is ground by a grinding wheel to suppress the motion of heavy metal in the wafer by a gettering effect and also to maintain the die strength of each device at about 1,000 MPa
7618875 Marking method for product information November 17, 2009
A product information marking method including a back side grinding step for grinding the back side of a wafer having a plurality of devices formed on the front side so as to be partitioned by a plurality of separation lines, thereby obtaining a desired thickness of the wafer. After










 
 
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