Resources Contact Us Home
Kobayashi; Yoshikazu
Ota-ku, JP
No. of patents:

Patent Number Title Of Patent Date Issued
7677955 Grinding method for wafer March 16, 2010
A grinding method for a wafer having a plurality of devices on the front side, wherein the back side of the wafer is ground by a grinding wheel to suppress the motion of heavy metal in the wafer by a gettering effect and also to maintain the die strength of each device at about 1,000 MPa
7618875 Marking method for product information November 17, 2009
A product information marking method including a back side grinding step for grinding the back side of a wafer having a plurality of devices formed on the front side so as to be partitioned by a plurality of separation lines, thereby obtaining a desired thickness of the wafer. After

  Recently Added Patents
Poly (alkyl epdxides), process for making, and lubricant compositions having same
Relative variable selection system and selection method thereof
Method for controlling partial lock in portable device having touch input unit
Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
Germ cells having inactivated endogenous immunoglobulin genes, and transgenic animals derived therefrom
Method and system for enhanced modulation of video signals
Integrated history-free and history-based modeling
  Randomly Featured Patents
Fuel device for a gasoline engine
Compounds and related methods for inhibition of gamma-aminobutyric acid aminotransferase
Logical amplitude level conversion circuit, liquid crystal device and electronic apparatus
Shoe upper
System for controlling spouted bed inlet conditions
Anti-breakage configuration for apparatus cutting threaded rods
Method of implanting an intraocular lens system
Automatic steering system for vehicle
Resin from phenolic and oxazoline using phosphorous acid ester as catalyst
Leakage restriction device for refrigeration cycle