Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Kobayashi; Yoshikazu
Address:
Ota-ku, JP
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
7677955 Grinding method for wafer March 16, 2010
A grinding method for a wafer having a plurality of devices on the front side, wherein the back side of the wafer is ground by a grinding wheel to suppress the motion of heavy metal in the wafer by a gettering effect and also to maintain the die strength of each device at about 1,000 MPa
7618875 Marking method for product information November 17, 2009
A product information marking method including a back side grinding step for grinding the back side of a wafer having a plurality of devices formed on the front side so as to be partitioned by a plurality of separation lines, thereby obtaining a desired thickness of the wafer. After










 
 
  Recently Added Patents
Apoptosis inductor extracted from potato, potato foodstuff containing the inductor, and processed product thereof
Forklift
Image scanner and image forming apparatus
Method and apparatus for diagnosing faults in a hybrid internet protocol network
Faucet
Bit error mitigation
Asset control in location tracking system
  Randomly Featured Patents
Intelligent network congestion control system
One-way clutch and power transmission apparatus
Organic EL device, driving method thereof, and electronic apparatus
Process for treatment of clarification sludge
Apparatus for switching electric power
Press forming method for aluminum alloy sheet and pressing device
Silicon compounds and their use
Inverter circuit for discharge lamps for multi-lamp lighting and surface light source system
Synchronized clocking disable and enable circuit
Plastic holding element with flexible connection between attachment and holding member