Resources Contact Us Home
Kobayashi; Yoshikazu
Ota-ku, JP
No. of patents:

Patent Number Title Of Patent Date Issued
7677955 Grinding method for wafer March 16, 2010
A grinding method for a wafer having a plurality of devices on the front side, wherein the back side of the wafer is ground by a grinding wheel to suppress the motion of heavy metal in the wafer by a gettering effect and also to maintain the die strength of each device at about 1,000 MPa
7618875 Marking method for product information November 17, 2009
A product information marking method including a back side grinding step for grinding the back side of a wafer having a plurality of devices formed on the front side so as to be partitioned by a plurality of separation lines, thereby obtaining a desired thickness of the wafer. After

  Recently Added Patents
Image forming apparatus, control method, and storage medium
Method for treating wounds for mammals, wound healer compound, and method of manufacturing thereof
Modified continuous phase modulation communications system and related methods
Method for conformal plasma immersed ion implantation assisted by atomic layer deposition
Laser receiver for detecting a relative position
Electronic device
Device and method for generating soft tissue contrast images
  Randomly Featured Patents
Pressure washer system and operating method
Focus detecting device
Hybrid pulse width modulation method and apparatus
Touch panel using a light sensing method, method for detecting a touch location, and recording medium storing program to execute the method
Thin film transistor including organic semiconductor layer and substrate including the same
Golf club head for a putter
Image recording apparatus using mask members and having monochromatic printer portion and manual mask member insertion tray
System of sound transducers with controllable directional properties
Wall-mountable rack for holding a razor or the like
Acoustic device