Resources Contact Us Home
Kobayashi; Yoshikazu
Ota-ku, JP
No. of patents:

Patent Number Title Of Patent Date Issued
7677955 Grinding method for wafer March 16, 2010
A grinding method for a wafer having a plurality of devices on the front side, wherein the back side of the wafer is ground by a grinding wheel to suppress the motion of heavy metal in the wafer by a gettering effect and also to maintain the die strength of each device at about 1,000 MPa
7618875 Marking method for product information November 17, 2009
A product information marking method including a back side grinding step for grinding the back side of a wafer having a plurality of devices formed on the front side so as to be partitioned by a plurality of separation lines, thereby obtaining a desired thickness of the wafer. After

  Recently Added Patents
Music composition automation including song structure
Can seam inspection
Solar powered charging shelter and system and method thereof
Antitumoral compounds
Method for the treatment, alleviation of symptoms of, relieving, improving and preventing a cognitive disease, disorder or condition
Vending machine
  Randomly Featured Patents
Soldering station with built-in self-calibration function
Method and apparatus for fusing thermoplastic materials
Tissue differentiation method based on surface enhanced Raman scattering
LED packaging structure
Image encoding method and device implementing an improved prediction, corresponding decoding method and device, signal and computer programs
Methods and apparatus for measuring web thickness and other characteristics of a moving web
Two-sided scintillation detectors and related methods
Meat separator machine with temperature reducing means
Self-ballasted compact fluorescent lamps
Actuating drive comprising two friction partners