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Inventor: Kobayashi; Yoshikazu
Address: Ota-ku, JP
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7677955 |
Grinding method for wafer |
March 16, 2010 |
| A grinding method for a wafer having a plurality of devices on the front side, wherein the back side of the wafer is ground by a grinding wheel to suppress the motion of heavy metal in the wafer by a gettering effect and also to maintain the die strength of each device at about 1,000 MPa |
| 7618875 |
Marking method for product information |
November 17, 2009 |
| A product information marking method including a back side grinding step for grinding the back side of a wafer having a plurality of devices formed on the front side so as to be partitioned by a plurality of separation lines, thereby obtaining a desired thickness of the wafer. After |
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