Resources Contact Us Home
Kobayashi; Yoshikazu
Ota-ku, JP
No. of patents:

Patent Number Title Of Patent Date Issued
7677955 Grinding method for wafer March 16, 2010
A grinding method for a wafer having a plurality of devices on the front side, wherein the back side of the wafer is ground by a grinding wheel to suppress the motion of heavy metal in the wafer by a gettering effect and also to maintain the die strength of each device at about 1,000 MPa
7618875 Marking method for product information November 17, 2009
A product information marking method including a back side grinding step for grinding the back side of a wafer having a plurality of devices formed on the front side so as to be partitioned by a plurality of separation lines, thereby obtaining a desired thickness of the wafer. After

  Recently Added Patents
User-initiated quality of service modification in a mobile device
Medical diagnosis, therapy, and prognosis system for invoked events and methods thereof
Medical injector
Azole derivatives, methods for producing the same, intermediate thereof, agro-horticultural agents
Systems and methods for documenting medical findings of a physical examination
Reliable event broadcaster with multiplexing and bandwidth control functions
Light emitting device and electronic device
  Randomly Featured Patents
Umbilical cord cutting and clamping device
Device manufacturing method, control system, computer program and computer-readable medium
Device and method for continuous mixing of at least two components
Microcapsules, their use and processes for their manufacture
Immobilization device
Apparatus for reinforcing utility poles and the like
Method and system for treatment of larger animals
Clear tomato concentrate as a taste enhancer
Methods and apparatus for providing robust synchronization of radio transceivers
Double cam taper lock connector pin apparatus