| |
 |
|
|
Inventor: Kobayashi; Takeshi
Address: Tochigi, JP
No. of patents: 6
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7723161 |
Lead frame, method of manufacturing the same, semiconductor device using lead frame and method o |
May 25, 2010 |
| There is provided a lead frame which comprises: a lead frame body comprising a sheet-shaped body made of metal; a groove portion for forming a lead which is formed by a predetermined depth in a lead forming region on a surface of the lead frame body; and a lead portion formed so that |
| 7659634 |
Lead frame, method of manufacturing the same, semiconductor device using lead frame and method o |
February 9, 2010 |
| There is provided a lead frame which comprises: a lead frame body comprising a sheet-shaped body made of metal; a groove portion for forming a lead which is formed by a predetermined depth in a lead forming region on a surface of the lead frame body; and a lead portion formed so that |
| 6779264 |
Electronic device |
August 24, 2004 |
| A method for manufacturing an electronic device by placing within a die a first lead with an element placement pad, a second lead, and an electronic element placed on the element placement pad. The electronic element, the element placement pad, a part of the first lead, and a part of the |
| 6504097 |
Electronic device |
January 7, 2003 |
| A resin sealed electronic device has an electronic element (30), a first external lead (10) with an element placement pad (11) having a thickness t of less than 0.1 mm, and a second external lead (20), which is disposed at a distance from the element placement pad (11), the first externa |
| 6440774 |
Electronic device, method of manufacturing the same, and apparatus for manufacturing the same |
August 27, 2002 |
| An electronic device such as a semiconductor device, a method of manufacturing the same, and an apparatus for manufacturing the same, wherein by placing a ceramic substrate provided with a metallic thin film integrated into at least one selected from an upper surface and a lower surf |
| 6350631 |
Electronic device, method of manufacturing the same, and apparatus for manufacturing the same |
February 26, 2002 |
| An electronic device such as a semiconductor device, a method of manufacturing the same, and an apparatus for manufacturing the same, wherein by placing a ceramic substrate provided with a metallic thin film integrated into at least one selected from an upper surface and a lower surf |
|
|
|