Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Kobayashi; Takeshi
Address:
Tochigi, JP
No. of patents:
6
Patents:












Patent Number Title Of Patent Date Issued
7723161 Lead frame, method of manufacturing the same, semiconductor device using lead frame and method o May 25, 2010
There is provided a lead frame which comprises: a lead frame body comprising a sheet-shaped body made of metal; a groove portion for forming a lead which is formed by a predetermined depth in a lead forming region on a surface of the lead frame body; and a lead portion formed so that
7659634 Lead frame, method of manufacturing the same, semiconductor device using lead frame and method o February 9, 2010
There is provided a lead frame which comprises: a lead frame body comprising a sheet-shaped body made of metal; a groove portion for forming a lead which is formed by a predetermined depth in a lead forming region on a surface of the lead frame body; and a lead portion formed so that
6779264 Electronic device August 24, 2004
A method for manufacturing an electronic device by placing within a die a first lead with an element placement pad, a second lead, and an electronic element placed on the element placement pad. The electronic element, the element placement pad, a part of the first lead, and a part of the
6504097 Electronic device January 7, 2003
A resin sealed electronic device has an electronic element (30), a first external lead (10) with an element placement pad (11) having a thickness t of less than 0.1 mm, and a second external lead (20), which is disposed at a distance from the element placement pad (11), the first externa
6440774 Electronic device, method of manufacturing the same, and apparatus for manufacturing the same August 27, 2002
An electronic device such as a semiconductor device, a method of manufacturing the same, and an apparatus for manufacturing the same, wherein by placing a ceramic substrate provided with a metallic thin film integrated into at least one selected from an upper surface and a lower surf
6350631 Electronic device, method of manufacturing the same, and apparatus for manufacturing the same February 26, 2002
An electronic device such as a semiconductor device, a method of manufacturing the same, and an apparatus for manufacturing the same, wherein by placing a ceramic substrate provided with a metallic thin film integrated into at least one selected from an upper surface and a lower surf










 
 
  Recently Added Patents
Methods for selective reverse mask planarization and interconnect structures formed thereby
Nozzle
Visualization of information associated with applications in user interfaces
Thermoplastic resin composition
Photoelectric conversion device
Closed cell culture system
Can seam inspection
  Randomly Featured Patents
Fall restraint anchoring post
Alternator system multifunction fault detector
Method of manufacturing a sintered body
Ink jet process including removal of excess liquid from an intermediate member
Perfusion and occlusion device and method
Mechanical splice optical fiber connector
Inkjet printing system
Expression of hepatitis B S and preS.sub.2 proteins in methylotrophic
Latch assembly for vehicle seat
Procedure and device for welding studs and similar parts to a work piece