Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Ko; Jeng-Dar
Address:
Pade, TW
No. of patents:
5
Patents:












Patent Number Title Of Patent Date Issued
8587091 Wafer-leveled chip packaging structure and method thereof November 19, 2013
A wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the firs
7838333 Electronic device package and method of manufacturing the same November 23, 2010
The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic device package with enhanced electrical performance and heat-dissipation efficiency are
7632707 Electronic device package and method of manufacturing the same December 15, 2009
The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic device package with enhanced electrical performance and heat-dissipation efficiency are
7528009 Wafer-leveled chip packaging structure and method thereof May 5, 2009
This invention relates to a wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating la
7294920 Wafer-leveled chip packaging structure and method thereof November 13, 2007
This invention relates to a wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating la










 
 
  Recently Added Patents
Network decoys
Personal alarm device for headwear for proximity detection
Method and system for generating and displaying an interactive dynamic graph view of multiply connected objects
Optoelectronic semiconductor chip comprising a reflective layer
Plural component proportioner
Control device of hybrid vehicle
Thermoplastic fluoropolymer composition
  Randomly Featured Patents
Paper post processing apparatus
Cooling air flow control valve for burn-in system
Digital NMR signal processing systems and methods
Pressure controllable incubation system
Disk cartridge
Tension fastener
Process for quenching and cleaning a fuel gas mixture
Automobile central vacuum cleaning system
Image processing apparatus and method thereof
Surface acoustic wave devices for processing and storing signals