Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Kimura; Norio
Address:
Fujisawa, JP
No. of patents:
57
Patents:


1 2










Patent Number Title Of Patent Date Issued
RE39471 Apparatus for and method for polishing workpiece January 16, 2007
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fl
RE38854 Apparatus for and method for polishing workpiece October 25, 2005
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid
RE38826 Apparatus for and method for polishing workpiece October 11, 2005
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid
7279408 Semiconductor device, method for manufacturing the same, and plating solution October 9, 2007
The present invention relates to a semiconductor device and a method for manufacturing the same. The semiconductor device has an embedded interconnect structure in which an electric conductor, such as copper or silver, is embedded in fine recesses formed in a surface of a semiconduct
7208074 Substrate processing apparatus and substrate plating apparatus April 24, 2007
A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a substrate to be loaded
7169235 Cleaning method and polishing apparatus employing such cleaning method January 30, 2007
A method is suitable for cleaning substrates, after polishing, that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The method includes polishing a substrate using an abrasive liquid containing abrasive particles, and
7108589 Polishing apparatus and method September 19, 2006
A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary m
7101259 Polishing method and apparatus September 5, 2006
A polishing apparatus is used for chemical mechanical polishing a copper (Cu) layer formed on a substrate such as a semiconductor wafer and then cleaning the polished substrate. The polishing apparatus has a polishing section having a turntable with a polishing surface and a top ring for
7060618 Semiconductor device, method for manufacturing the same, and plating solution June 13, 2006
The present invention relates to a semiconductor device and a method for manufacturing the same. The semiconductor device has an embedded interconnect structure in which an electric conductor, such as copper or silver, is embedded in fine recesses formed in a surface of a semiconduct
6984164 Polishing apparatus January 10, 2006
A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring f
6935932 Polishing apparatus and method August 30, 2005
A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal
6929722 Substrate plating apparatus August 16, 2005
A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including th
6913513 Polishing apparatus July 5, 2005
A polishing apparatus comprises a polishing table having a polishing surface, a top ring for holding a substrate and pressing a surface of the substrate against the polishing surface to polish the surface of the substrate, and at least one optical measuring device disposed adjacent to
6905400 Method and apparatus for dressing polishing cloth June 14, 2005
A polishing cloth mounted on a turntable is dressed by bringing a dresser in contact with the polishing cloth for restoring the polishing capability of the polishing cloth. The dressing is performed by measuring heights of a surface of the polishing cloth at radial positions of the polis
6843706 Polishing apparatus January 18, 2005
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish, and allows a polishing pad to be automatically replaced without stopping rotary or circulatory motion of a polishing table. The polishing apparatus comprises a polishing table f
6764381 Polishing apparatus July 20, 2004
A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for
6752692 Cleaning method and polishing apparatus employing such cleaning method June 22, 2004
A method is suitable for cleaning substrates, after polishing, that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The method includes polishing a substrate using an abrasive liquid containing abrasive particles, and
6722964 Polishing apparatus and method April 20, 2004
A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal
6716330 Electroless plating apparatus and method April 6, 2004
An plating apparatus which can easily form a plated film having more uniform thickness on a surface, to be plate, of a material to be plated. The plating apparatus includes a holding portion having a heating portion for holding a material to be plated in such a state that a surface to be
6689257 Substrate processing apparatus and substrate plating apparatus February 10, 2004
A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a substrate to be loaded
6667238 Polishing method and apparatus December 23, 2003
A polishing apparatus is used for chemical mechanical polishing a copper (Cu) layer formed on a substrate such as a semiconductor wafer and then cleaning the polished substrate. The polishing apparatus has a polishing section having a turntable with a polishing surface and a top ring for
6645053 Polishing apparatus November 11, 2003
A polishing apparatus has a turntable with a polishing cloth attached thereto and a top ring for holding and pressing a workpiece to be polished against the polishing cloth under a certain pressure. The polishing apparatus also has a first dressing unit having a contact-type dresser for
6626736 Polishing apparatus September 30, 2003
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish, and allows a polishing pad to be automatically replaced without stopping rotary or circulatory motion of a polishing table. The polishing apparatus comprises a polishing table f
6579152 Polishing apparatus June 17, 2003
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface, and a top ring having a pressing surface for holding a workpiece to be polished and pressing the wor
6558239 Polishing apparatus May 6, 2003
A polishing apparatus has a feed reel for feeding a polishing tape wound thereon and having a polishing surface, a take-up reel for reeling up the polishing tape from the feed reel, a presser for pressing the polishing tape between the feed reel and the take-up reel against a surface, to
6558229 Polishing apparatus May 6, 2003
A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for
6544111 Polishing apparatus and polishing table therefor April 8, 2003
A polishing apparatus can strictly control the degree of material removal by providing close control over the operating temperature in the polishing table (12). The polishing apparatus has a polishing table (12) and a workpiece holder (14) for pressing a workpiece (W) towards the polishi
6443821 Workpiece carrier and polishing apparatus having workpiece carrier September 3, 2002
A workpiece carrier holds a workpiece such as a semiconductor wafer and presses the workpiece against a polishing surface on a polishing table. The workpiece carrier has a top ring body for holding the workpiece, and a retainer ring for holding an outer circumferential edge of the workpi
6439980 Workpiece carrier and polishing apparatus having workpiece carrier August 27, 2002
A workpiece carrier has a top ring body for holding a workpiece, a drive shaft for rotating the top ring body and moving the top ring body toward a turntable to press the workpiece against a polishing surface, and a universal joint for transmitting a pressing force from the drive shaft t
6428403 Polishing apparatus August 6, 2002
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the polishing cloth under a first pressing force to polish t
6416384 Method and apparatus for polishing July 9, 2002
A polishing apparatus can improve the uniformity of thickness within a workpiece or reduce thickness variation between serially polished workpieces. The polishing apparatus comprises a polishing unit having a polishing tool for providing a polishing surface and a workpiece holding de
6413357 Polishing apparatus July 2, 2002
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish by a combination of chemical polishing and mechanical polishing. The polishing apparatus includes a turntable with a polishing cloth mounted on an upper surface thereof, a to
6364752 Method and apparatus for dressing polishing cloth April 2, 2002
A polishing cloth mounted on a turntable is dressed by bringing a dresser in contact with the polishing cloth for restoring the polishing capability of the polishing cloth. The dressing is performed by measuring heights of a surface of the polishing cloth at radial positions of the polis
6350346 Apparatus for polishing workpiece February 26, 2002
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the abrasive cloth under a first pressing force to polish th
6328629 Method and apparatus for polishing workpiece December 11, 2001
A workpiece such as a semiconductor wafer is held by a top ring, and a lower surface of the workpiece is polished to a flat mirror finish by being pressed against a polishing surface of the turntable while the top ring and the turntable are rotated. While the workpiece is being polished,
6325698 Cleaning method and polishing apparatus employing such cleaning method December 4, 2001
A method is suitable for cleaning substrates, after polishing, that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The method includes polishing a substrate using an abrasive liquid containing abrasive particles, and
6294059 Substrate plating apparatus September 25, 2001
A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including th
6139677 Polishing apparatus October 31, 2000
A polishing apparatus 70 is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish by a combination of chemical polishing and mechanical polishing. The polishing apparatus includes a turntable 73 with a polishing 74 cloth mounted on an upper surface ther
6077385 Polishing apparatus June 20, 2000
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the polishing cloth under a first pressing force to polish t
6033520 Apparatus for and method of polishing workpiece March 7, 2000
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the abrasive cloth under a first pressing force to polish th
6024633 Workpiece holding device and polishing apparatus therewith February 15, 2000
A workpiece holding device enables stable polishing to be performed without sacrificing the structural strength of a top ring or the space necessary for machining a through hole or implanting engaging pins while allowing close contact to be made between a workpiece to a polishing cloth o
6019868 Polishing apparatus February 1, 2000
A polishing apparatus for polishing a workpiece to a flat mirror finish includes a turntable with a polishing cloth attached to an upper surface thereof, and a top ring for holding a workpiece thereon and pressing the workpiece against the polishing cloth to polish the workpiece. A retai
5989107 Method for polishing workpieces and apparatus therefor November 23, 1999
A polishing method and a compact apparatus for the method are presented for efficient production of a polished workpiece for manufacturing high technology devices. The polishing method comprises a first and second steps for polishing a work surface. In the first polishing step, the work
5980685 Polishing apparatus November 9, 1999
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, and a top ring having a pressing surface for holding a workpiece to be polished and pressing the wo
5921852 Polishing apparatus having a cloth cartridge July 13, 1999
A polishing apparatus such as a semiconductor wafer. The polishing apparatus has a turntable, a cloth cartridge detachably exchangeably mounted on the turntable, and a top ring for holding a workpiece and pressing the workpiece against the polishing cloth. The cloth cartridge include
5916412 Apparatus for and method of polishing workpiece June 29, 1999
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the abrasive cloth under a first pressing force to polish th
5876273 Apparatus for polishing a wafer March 2, 1999
A polishing apparatus is provided which improves uniformity across the surface of a polished wafer. The apparatus includes a wafer carrier, a guide ring coupled to a lower portion of the wafer carrier, a circular plate coupled to a first inner circumference portion of the guide ring
5857898 Method of and apparatus for dressing polishing cloth January 12, 1999
A polishing cloth is dressed between polishing processes each for polishing a workpiece such as a semiconductor wafer. The polishing cloth is dressed while supplying a dressing liquid such as water during a dressing process, and an abrasive liquid for polishing a workpiece is supplied to
5839947 Polishing apparatus November 24, 1998
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, a top ring, for holding a workpiece to be polished and pressing the workpiece against the po
5830041 Method and apparatus for determining endpoint during a polishing process November 3, 1998
A method and apparatus for determining a planar end point on a workpiece such as a semiconductor wafer in a polishing process for polishing the workpiece to a flat mirror finish. The workpiece having an uneven surface is held by a top ring and pressed against a polishing platen. The
1 2










 
 
  Recently Added Patents
Undercabinet plug-in mount
Hierarchical binding and lookup of addresses in inter-process communications systems
Magnesium metal-air battery
Active constant power supply apparatus
Technique for skipping irrelevant portions of documents during streaming XPath evaluation
Vanadium, cobalt and strontium additives for use in aluminum back solar cell contacts
Active pulse blood constituent monitoring
  Randomly Featured Patents
Liquid applicator with opposed wings
Knitting machine
Laryngo-tracheal analgesia endotracheal tube
Paging amplifier console
Breading tray
Armature lamina for a dynamoelectric machine
Content processing limit method, content processing limit program, and content edition device
Method for preparation of hybrid comprising magnetite nanoparticles and carbon nitride nanotubes
Component transaction server for developing and deploying transaction- intensive business applications
Multi-layer board