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Inventor: Katz; Zachary B.
Address: Boise, ID
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7554171 |
Semiconductor constructions |
June 30, 2009 |
| The invention includes a method of forming a planarized surface over a semiconductor substrate. A substrate is provided which includes a memory array region and a peripheral region proximate the memory array region. The memory array region has a higher average elevational height than the |
| 7037840 |
Methods of forming planarized surfaces over semiconductor substrates |
May 2, 2006 |
| The invention includes a method of forming a planarized surface over a semiconductor substrate. A substrate is provided which includes a memory array region and a peripheral region proximate the memory array region. The memory array region has a higher average elevational height than the |
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