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Inventor: Kang; Uu-Byung
Address: Hwaseong-si, KR
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7554201 |
Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same |
June 30, 2009 |
| Example embodiments of the present invention relate to an alloy solder and a semiconductor device using the alloy solder. Other example embodiments relate to an alloy solder capable of increasing reliability of a junction between a semiconductor chip and a substrate. According to still I |
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