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Inventor: Kang; Gyung Soo
Address: Gwangju, KR
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7452432 |
Apparatus for and method of bonding nano-tip using electrochemical etching |
November 18, 2008 |
| Disclosed herein are an apparatus for and a method of bonding a nano-tip using electrochemical etching, in which a good bonding stability can be provided. The nano-tip bonding apparatus comprises a glass plate having a top surface of a certain desired area. An electrolytic solution havin |
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