Resources Contact Us Home
Kamiura; Yuuki
Hyogo, JP
No. of patents:

Patent Number Title Of Patent Date Issued
6759317 Method of manufacturing semiconductor device having passivation film and buffer coating film July 6, 2004
An interconnection is formed on a semiconductor substrate having a semiconductor element formed thereon. Next, a passivation film is formed on the semiconductor substrate including the interconnection. Further, a polyimide film, which is served as a buffer coating film, is formed on the
6645859 Semiconductor device and manufacturing method thereof November 11, 2003
A manufacturing method of a semiconductor device allowing successful filling of an insulating film by HDP-CVD (High Density Plasma-Chemical Vapor Deposition) in a gap or valley between densely placed interconnections is provided. The method includes the steps of forming semiconductor
6544904 Method of manufacturing semiconductor device April 8, 2003
A method of manufacturing a semiconductor device is provided, which prevents a polyimide film from coming unstuck from a film to be subjected to isotropic etching, and further prevents deposits adhered to respective side faces of the films from coming off, during a heat treatment for

  Recently Added Patents
Method and arrangement for controlling semiconductor component
Case for electronic device
Hedge shear
Fixing device, fixing device control method, and image forming apparatus
Heat retaining device
Local call local switching at handover
  Randomly Featured Patents
Method of supporting plastic containers during product filling and packaging when exposed to elevated temperatures and internal pressure variations
Packet forwarding apparatus and method
Drumhead construction
Automobile antenna system
Vehicle, toy, and/or replicas thereof
Openable bag construction
Nasal support device for domestic mammals and method
Portable cigar humidifier
Tool pack apparatus