| Patent Number |
Title Of Patent |
Date Issued |
| 7626268 |
Support structures for semiconductor devices |
December 1, 2009 |
| Support structures for semiconductor devices and methods of manufacturing thereof are disclosed. In some embodiments, the support structures include a plurality of support members that is formed in a substantially annular shape beneath a wire bond region. The central region inside the |
| 7553703 |
Methods of forming an interconnect structure |
June 30, 2009 |
| Semiconductor devices having conductive lines with extended ends and methods of extending conductive line ends by a variable distance are disclosed. An end of a first conductive feature of an interconnect structure is extended by a first distance, and an end of a second conductive fe |
| 7332812 |
Memory card with connecting portions for connection to an adapter |
February 19, 2008 |
| Semiconductor devices having conductive lines with extended ends and methods of extending conductive line ends by a variable distance are disclosed. An end of a first conductive feature of an interconnect structure is extended by a first distance, and an end of a second conductive fe |
| 7201634 |
Polishing methods and apparatus |
April 10, 2007 |
| Apparatus for and methods of chemical mechanical polishing (CMP) of semiconductor wafers are disclosed. A preferred embodiment comprises an apparatus for polishing a semiconductor workpiece that includes a polishing pad, a fluid dispenser adapted to dispense a fluid to the polishing |
