| Patent Number |
Title Of Patent |
Date Issued |
| 7556089 |
Liquid cooled thermosiphon with condenser coil running in and out of liquid refrigerant |
July 7, 2009 |
| The invention provides a fluid heat exchange assembly comprising a housing containing a liquid refrigerant presenting a surface. A tube is coiled in adjacent coils around an axis parallel to the surface of the liquid refrigerant with a first sector of each coil disposed below the liquid |
| 7556088 |
Thermosiphon for laptop computer |
July 7, 2009 |
| A heat exchanger assembly for cooling an electronic element includes an oblong condensing tube extending between ends to define an upper chamber downwardly bowed through an upwardly extending arc and a lower chamber upwardly bowed through a downwardly extending arc for dissipating heat. |
| 7509995 |
Heat dissipation element for cooling electronic devices |
March 31, 2009 |
| A heat dissipation element for cooling an electronic device is disclosed. The heat dissipation element has a top surface and a bottom surface for mounting the electronic device to be cooled thereto. The top surface defines a heat dissipation area for dissipating heat from the electronic |
| 7497249 |
Thermosiphon for laptop computer |
March 3, 2009 |
| A heat exchanger assembly is provided including a multi-function boiling chamber having a top wall and a bottom wall parallel to the top wall and a first side wall and a second side wall both extending inwardly from the bottom wall to the top wall and a pair of end walls closing the cham |
| 7477516 |
Air cooled computer chip |
January 13, 2009 |
| A cooling assembly includes a housing supporting a nozzle for directing cooling air over an electronic component. A casing rotatably supports a shaft, which in turn, supports a compressor, an expander, and an electric motor, for circulating air and delivering the cooling air to the nozzl |
| 7475718 |
Orientation insensitive multi chamber thermosiphon |
January 13, 2009 |
| A hermetically sealed housing includes a plurality of inner walls extending radially from a central post to a circular outer wall, thereby defining a plurality of pie shaped chambers, each independently containing a refrigerant. At least one of the chambers is always in position to r |
| 7438124 |
Evaporative cooling system for a data-communications cabinet |
October 21, 2008 |
| An electronics cabinet for storing a plurality of electronic devices therein is provided and includes a fan and an evaporative cooler. The fan draws a flow of air into the cabinet, circulates the flow of air through the evaporative cooler, and then across the electronic devices for r |
| 7424906 |
High performance thermosiphon with internally enhanced condensation |
September 16, 2008 |
| A thermosiphon cooling assembly includes a refrigerant disposed in a lower portion of a housing for undergoing a liquid-to-vapor-to-condensate cycle. A mixing device is disposed within the lower portion of the housing for increasing the transfer of heat from the electronic device dur |
| 7422052 |
Low profile thermosiphon |
September 9, 2008 |
| A thermosiphon cooling assembly for dissipating heat generated by an electronic device includes a housing having a housing top, housing bottom and opposing sides. The opposing sides extend between the housing top and the housing bottom to define a low profile entrance and a low profile |
| 7280363 |
Apparatus for controlling thermal interface between cold plate and integrated circuit chip |
October 9, 2007 |
| The invention provides a heat sink device for receiving heat generated by an electrical chip. The heat sink device includes a cold plate having a bottom surface for receiving heat from the electrical chip and a top surface opposite of the bottom surface. The heat sink device also inc |
| 7278471 |
Multi-layered micro-channel heat sink |
October 9, 2007 |
| The subject invention provides a heat sink for a liquid cooling system. The heat sink includes a spreader plate for contacting an electronic device and a body having a plurality of channels extending through the body and arranged in layers. Each layer includes a quantity of the chann |
| 7278468 |
Heat sink with multiple coolant inlets |
October 9, 2007 |
| The subject invention provides a heat sink for cooling electronic devices. The heat sink includes an upper chamber and a lower chamber separated by a baffle therebetween. The lower chamber includes a base having a central axis and a plurality of curvilinear fins disposed radially about t |
| 7269011 |
Impingement cooled heat sink with uniformly spaced curved channels |
September 11, 2007 |
| A heat sink assembly for removing heat from an electronic device and comprising a base, a lid in spaced relationship with and parallel to the base, and an outer wall spiraling radially outwardly about an inlet axis from an inner exit position to an outer exit position to define a tan |
| 7213636 |
Cooling assembly with impingement cooled heat sink |
May 8, 2007 |
| The subject invention provides a cooling assembly for removing heat from an electronic device. The cooling assembly includes a heat sink having a base plate and a plurality of fins extending upwardly from the base plate to a top extremity. A nozzle directs a flow of cooling fluid onto th |
| 7204299 |
Cooling assembly with sucessively contracting and expanding coolant flow |
April 17, 2007 |
| A fluid heat exchanger assembly having an upper wall and a lower wall extending between the inlet and the outlet for establishing a direction of flow to cool an electronic device. A plurality of projections extend linearly transversely across the direction of flow to define rows of p |
| 7080683 |
Flat tube evaporator with enhanced refrigerant flow passages |
July 25, 2006 |
| A heat exchanger for a heating, ventilating and air conditioning system comprises a plurality of heat exchange tubes extending between a pair of spaced header tanks and arranged in groups of tubes with varying number of tubes in each group to cause a refrigerant to flow in multiple passe |
| 6834713 |
Thermosiphon for electronics cooling with nonuniform airflow |
December 28, 2004 |
| A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defi |
| 6695039 |
Orientation insensitive thermosiphon assembly for cooling electronic components |
February 24, 2004 |
| A thermosiphon assembly for dissipating heat generated by an electronic component using a working fluid is disclosed. The assembly includes an evaporator having a front face, a rear face, and a peripheral wall extending between the front face and the rear face and being arcuate. A he |
| 6615911 |
High performance liquid-cooled heat sink with twisted tape inserts for electronics cooling |
September 9, 2003 |
| A liquid-cooled heat sink for use in combination with a heat exchanger to cool electronic or electrical devices attached to said heat sink comprises a metal block having a plurality of circular passageways therethrough defined by cylindrical walls. An inlet is in fluid communication with |
| 6615910 |
Advanced air cooled heat sink |
September 9, 2003 |
| A heat sink for cooling electrical or electronic devices comprises a base plate having a top surface and having a bottom surface for attaching to the electronic device. A folded fin formed from a strip of heat conducting material includes alternating planar portions and curved portions h |
| 6591897 |
High performance pin fin heat sink for electronics cooling |
July 15, 2003 |
| A heat sink for electronic devices comprises a spreader plate having a top surface and having a bottom surface wherein a portion thereof is defined for affixing an electronic device to be cooled thereto. A plurality of columnar pins are spaced apart one from the other in a non-uniform ma |
| 6588498 |
Thermosiphon for electronics cooling with high performance boiling and condensing surfaces |
July 8, 2003 |
| A thermosiphon for cooling an electronic device having a mean width of dimension "b" comprises a boilerplate having a top surface and including a plurality of pyramid shaped fins projecting upwardly from the top surface. The boilerplate also has a bottom surface for receiving the electro |
| 6439300 |
Evaporator with enhanced condensate drainage |
August 27, 2002 |
| An evaporator (10) with opposed pairs of generally vertically oriented flow tube surfaces (14) has corrugated air fins in which the tube surface spacing c, the interior radius r of a crest (20) joining adjacent pairs of fin walls (18), the fin pitch p separating adjacent crests (20), and |
| 6341649 |
Aluminum plate oil cooler |
January 29, 2002 |
| The aluminum plate oil cooler includes a plurality of pairs of plates that are secured along their perimeter to define an oil flow path. The plates include embossed regions that are formed to provide inlet and outlet ports for the oil. Top and bottom reinforcement plates are positioned a |
