| Patent Number |
Title Of Patent |
Date Issued |
| 7285890 |
Magnet retention on rotors |
October 23, 2007 |
| Permanent magnets are mounted on a rotor of an electrical motor by an apparatus that keeps an adhesive bonding layer between the magnet and rotor in compression over wide variations in temperature and speed of rotation. The mechanical stresses on the magnets are controlled using comp |
| 7152696 |
Method and control system for directional drilling |
December 26, 2006 |
| A method and control system for directional drilling are described. A drill string motor is commanded to rotate at a constant speed in a forward direction and the constant speed in a reverse direction for a first duration and a second duration, respectively, for at least one oscillat |
| 6925807 |
Actuator control system for hydraulic devices |
August 9, 2005 |
| An apparatus and method for controlling an actuator system having an electrical actuator in hydraulic communication with a hydraulic actuator are described. The apparatus includes a controller module in communication with a source of electrical power and a transceiver. The transceiver is |
| 6894418 |
Nested stator coils for permanent magnet machines |
May 17, 2005 |
| An arrangement of coils of different configurations for use in the stator of a slotless radial gap electromotive machine is described. The coils include coils of a first configuration and a second configuration. Each coil includes longitudinal sections and circumferential sections that f |
| 6803760 |
Apparatus and method for determining an angular position of a rotating component |
October 12, 2004 |
| An apparatus for determining the angular position of a rotating component having a plurality of angularly spaced magnetic elements is described. The apparatus includes a sensor board and a processor circuit. The sensor board is disposed adjacent to the rotating component and includes a |
| 5463250 |
Semiconductor component package |
October 31, 1995 |
| A package for power semiconductor components permitting high thermal dissipation and current conductance and including a frame assembly bonded to a substrate on which a power semiconductor chip is mounted. The frame assembly has a wirebonding grid for connecting short, uniform length |
