| Patent Number |
Title Of Patent |
Date Issued |
| 5956596 |
Method of forming and cleaning a laser marking region at a round zone of a semiconductor wafer |
September 21, 1999 |
| The invention relates to a wafer for use as a substrate for a semiconductor device, the wafer comprising a round zone formed along a circumference thereof; a flat zone wherein the circumference thereof is partially cut in a straight line; and a laser marking region functioning as a wafer |
| 5740065 |
Method for manufacturing semiconductor device |
April 14, 1998 |
| A method for manufacturing a semiconductor device comprises the steps of extracting an optimal working condition by accumulatively averaging accumulated working conditions of lots previously performed in an expectation process to be currently performed in the manufacturing equipment, |
| 5729856 |
Semiconductor wafer cleaning apparatus |
March 24, 1998 |
| A semiconductor wafer cleaning apparatus having an edge rinse member adapted for rinsing edges of a semiconductor wafer and having a moving member adapted to permit horizontally movement of the edge rinse member, wherein the apparatus is adapted to minimize or prevent an upper surface |
