| Patent Number |
Title Of Patent |
Date Issued |
| 7139641 |
Wafer protection system |
November 21, 2006 |
| A system for protecting wafers from damage caused by an inaccurately-positioned wafer transfer robot blade during the transfer of wafers typically from a wafer cassette to a processing tool. The wafer protection system includes a conductor foil which is electrically separated from th |
| 6998013 |
CMP apparatus polishing head with concentric pressure zones |
February 14, 2006 |
| A CMP polishing head having multiple concentric pressure zones for selectively increasing polishing pressure against selected regions of a semiconductor wafer in order to compensate for variations in polishing rates on the wafer surface otherwise caused by ridges or other non-uniform |
| 6964419 |
Chuck rollers and pins for substrate cleaning and drying system |
November 15, 2005 |
| A design for chuck rollers and a design for chuck pins for a wafer cleaning and drying system is disclosed. Each of the chuck rollers includes a roller head which ensures proper engagement of a wafer with the chuck rollers for rotation of the wafer during a wafer scrubbing process. Each |
| 6758724 |
Online tension monitor system for robot x-belt of mirra CMP |
July 6, 2004 |
| A method and system for monitoring tension associated with a robot-controlled belt utilized in a semiconductor wafer polishing apparatus. A belt tension monitor can be adapted for use with the semiconductor wafer polishing apparatus to detect a variable tension of the robot-controlle |
| 6516675 |
Bubble ultrasonic flow meter |
February 11, 2003 |
| A method and apparatus for preventing flow rate errors derived from an ultrasonic flow meter utilized in semiconductor fabrication operations. The ultrasonic flow meter is generally configured to include an extension chamber connected to a thin branch tube of the ultrasonic flow meter. A |
